Patents by Inventor Jesse Theissen

Jesse Theissen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for attachment of integrated circuits
    Patent number: 9635794
    Abstract: Method and apparatus for bonding an electrical circuit component onto a substrate. A first electrically conductive bonding pad is formed on the component, and a second electrically conductive bonding pad is formed on the substrate. One of said first and second bonding pads is physically split into at least two parts, with electrical discontinuity between the two parts. An electrically conductive bond is formed between the first and second bonding pads such that electrical continuity is established from one part of the one bonding pad, through the other of the bonding pads, and through the second part of the one bonding pad. The integrity of the electrically conductive bond is evaluated by testing electrical continuity between the at least two parts.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: April 25, 2017
    Assignee: TRW Automotive U.S. LLC
    Inventors: Mike Babala, Jesse Theissen