Abstract: An aircraft skin coating assembly for an aircraft. The coating assembly includes a primer layer deposited on the aircraft skin, an optical stop-etch layer deposited on the primer layer that is reflective at a predetermined wavelength, a coating stack-up deposited on the optical etch-stop layer that provides performance features for the aircraft, and a sealant layer deposited on the stack-up. When a laser coating removal process employing a laser beam is used to remove the coating stack-up for replacement, the stop-etch layer reflects the laser beam to prevent it from penetrating and possibly damaging the aircraft skin.

Abstract: A heat pipe that employs a metal woodpile capillary wick. The heat pipe includes an outer enclosure defining a chamber therein that contains a working fluid, an evaporator section for converting the fluid to vapor in response to being heated from a heat source, and a condenser section for converting the vapor back into the fluid in response to cooling from a heat sink. The wick is positioned within the chamber in contact with the enclosure and extends between the evaporator section and the condenser section. The wick includes a plurality of layers each having spaced apart parallel thermally conductive bars defining channels therebetween, where the bars in adjacent layers are oriented in different directions and where the condensed fluid flows through the channels in the wick from the condenser section to the evaporator section.

Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

Abstract: The invention provides compounds of, and methods for the preparation of compounds of, the molecular formula, SixGeyHz—aXa; wherein X is halogen, and x, y, z, and a are defined herein, and methods for the deposition of high-Ge content Si films on silicon substrates using compounds of the invention.

Abstract: The invention provides compounds of, and methods for the preparation of compounds of, the molecular formula, SixGeyHz—aXa; wherein X is halogen, and x, y, z, and a are defined herein, and methods for the deposition of high-Ge content Si films on silicon substrates using compounds of the invention.