Abstract: A collapsible, compound level apparatus is provided and includes a first linear leveling section and a second linear leveling section. Each section includes at least one flat surface for contact with a work surface, and first and second bubble levels arranged for indicating level and plumb, respectively, of the work surface. The first section provides at one end thereof an engagement tongue that engages an engagement groove of one end of the second section, thereby providing colinear interconnection of the leveling sections and forming an integral linear structure for positioning the flat surfaces of each section in mutually coplanar contiguous alignment. The engagement tongue has an oblique surface and an end stop surface for contacting a mating oblique surface and a mating end stop surface of the engagement groove. The oblique surfaces and the mating end stop surfaces of each section form an acute angle.