Patents by Inventor Jessu Joys

Jessu Joys has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120294751
    Abstract: A lead-free, frangible bullet is provided. The lead-free, frangible bullet is manufactured without sintering or external heating of the bullet. The bullet is prepared by blending a lead-free copper powder mixture and cold compacting the powder in a die to form a bullet. The copper powder can be atomized copper powder, electrolytic copper powder, or a combination of atomized and electrolytic copper powder. The atomized copper powder can be water atomized, air atomized, and combination of water and air atomized. Preferably, the frangible bullet has a fragmentation less than 5 grains.
    Type: Application
    Filed: June 18, 2012
    Publication date: November 22, 2012
    Inventors: Jessu Joys, Barry Anshutz, K. Clive Ramsey
  • Patent number: 8312815
    Abstract: A lead-free, frangible bullet is provided. The lead-free, frangible bullet is manufactured without sintering or external heating of the bullet. The bullet is prepared by blending a lead-free copper powder mixture and cold compacting the powder in a die to form a bullet. The copper powder can be atomized copper powder, electrolytic copper powder, or a combination of atomized and electrolytic copper powder. The atomized copper powder can be water atomized, air atomized, and combination of water and air atomized. Preferably, the frangible bullet has a fragmentation less than 5 grains.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: November 20, 2012
    Assignee: United States Metal Powders Incorporated
    Inventors: Jessu Joys, Barry Anshutz, K. Clive Ramsey
  • Patent number: 8225718
    Abstract: A lead-free, frangible bullet is provided. The lead-free, frangible bullet is manufactured without sintering or external heating of the bullet. The bullet is prepared by blending a lead-free copper powder mixture and cold compacting the powder in a die to form a bullet. The copper powder can be atomized copper powder, electrolytic copper powder, or a combination of atomized and electrolytic copper powder. The atomized copper powder can be water atomized, air atomized, and combination of water and air atomized. Preferably, the frangible bullet has a fragmentation less than 5 grains.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: July 24, 2012
    Assignee: United States Metal Powders Incorporated
    Inventors: Jessu Joys, Barry Anshutz, K. Clive Ramsey
  • Publication number: 20100083861
    Abstract: A lead-free, frangible bullet is provided. The lead-free, frangible bullet is manufactured without sintering or external heating of the bullet. The bullet is prepared by blending a lead-free copper powder mixture and cold compacting the powder in a die to form a bullet. The copper powder can be atomized copper powder, electrolytic copper powder, or a combination of atomized and electrolytic copper powder. The atomized copper powder can be water atomized, air atomized, and combination of water and air atomized. Preferably, the frangible bullet has a fragmentation less than 5 grains.
    Type: Application
    Filed: October 8, 2009
    Publication date: April 8, 2010
    Inventors: Jessu Joys, Barry Anshutz, K. Clive Ramsey
  • Publication number: 20080156401
    Abstract: Infiltration compositions comprising chromium and at least about 80% copper. The infiltration compositions may further comprise iron, zinc, manganese, antimony and/or lubricants. Also, methods for infiltrating powder metal parts comprising contacting a powder metal part with the infiltration composition comprising chromium and at least about 80% copper and heating the powder metal part and infiltration composition to a temperature sufficient to melt the infiltration composition and allow the infiltration composition to infiltrate through pores in the powder metal part.
    Type: Application
    Filed: January 3, 2008
    Publication date: July 3, 2008
    Inventors: Arun K. Chattopadhyay, Jessu Joys