Patents by Inventor Jesus Al Ortiz

Jesus Al Ortiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference shielding of electrical cables and connectors
    Patent number: 7414197
    Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: August 19, 2008
    Assignee: WaveZero, Inc.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • Electromagnetic interference shielding of electrical cables and connectors
    Patent number: 7102082
    Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: September 5, 2006
    Assignee: WaveZero, Inc.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • Electromagnetic interference shielding of electrical cables and connectors
    Publication number: 20040187311
    Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
    Type: Application
    Filed: October 21, 2003
    Publication date: September 30, 2004
    Applicant: Shielding for Electronics, Inc.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • Methods for shielding of cables and connectors
    Patent number: 6643918
    Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: November 11, 2003
    Assignee: Shielding for Electronics, Inc.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • Electromagnetic interference shielding of electrical cables and connectors
    Publication number: 20010040043
    Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
    Type: Application
    Filed: February 16, 2001
    Publication date: November 15, 2001
    Applicant: SHIELDING FOR ELECTRONICS, INC.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold
  • EMI and RFI shielding for printed circuit boards
    Publication number: 20010033478
    Abstract: The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC.
    Type: Application
    Filed: February 16, 2001
    Publication date: October 25, 2001
    Applicant: SHIELDING FOR ELECTRONICS, INC.
    Inventors: Jesus Al Ortiz, Rocky R. Arnold