Abstract: A method of performing a total knee arthroplasty including the steps of inserting a first pin into the distal femur and through the knee center, locating the femoral mechanical axis, inserting at least one additional pin into the distal femur, locating the tibial mechanical axis, sizing the femur and applying a femoral cutting block having at least one cutting guide to an end of the femur, positioning a tibial cutting block having a least one cutting guide in a cutting position relative to the tibia, aligning the femoral cutting block relative to the tibial cutting block, aligning the femur relative to the tibia, cutting the femur using the at least one femoral cutting guide, cutting the tibia using the at least one tibial cutting guide, removing the femoral and tibial cutting blocks, and positioning permanent femoral and tibial components on the cut portions of the femur and tibia, respectively.

Abstract: A method of performing a total knee arthroplasty including the steps of inserting a first pin into the distal femur and through the knee center, locating the femoral mechanical axis, inserting at least one additional pin into the distal femur, locating the tibial mechanical axis, sizing the femur and applying a femoral cutting block having at least one cutting guide to an end of the femur, positioning a tibial cutting block having a least one cutting guide in a cutting position relative to the tibia, aligning the femoral cutting block relative to the tibial cutting block, aligning the femur relative to the tibia, cutting the femur using the at least one femoral cutting guide, cutting the tibia using the at least one tibial cutting guide, removing the femoral and tibial cutting blocks, and positioning permanent femoral and tibial components on the cut portions of the femur and tibia, respectively.

Abstract: A system may include a static dissipative device to secure a semiconductor component, and a printer to print indicia on the semiconductor component while the semiconductor component is secured with the static dissipative device.

Abstract: A method of forming an interconnection structure in a microelectronic package, and an interconnection structure of a microelectronic package formed according to the method. The method includes: providing a combination including a first conductive layer and a dielectric layer fixed to the conductive layer; providing a hole through the dielectric layer extending from a surface of the dielectric layer to the first conductive layer; providing a recess in the first conductive layer and in communication with the hole to provide an interlocking volume under the dielectric layer; providing a conductive material in the hole and in the recess to form a package via having an interlocking section in the interlocking volume of the recess; and providing a conductive material on the dielectric layer to form a second conductive layer adapted to be in electrical contact with the first conductive layer through the package via.