Abstract: A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles.