Abstract: There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.

Abstract: There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.

Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.

Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.

Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.

Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.