Patents by Inventor Jeung-Il Kim

Jeung-Il Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11471534
    Abstract: The present invention relates to a transdermal nano-carrier and, more specifically, to a nano-carrier having a chitosan-based nano-sponge structure. According to the present invention, as a nano-carrier having enhanced transdermal delivery on the basis of a complex containing chitosan is provided, it is possible to effectively deliver drugs, cosmetic materials, etc. into the skin.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 18, 2022
    Assignee: SKINMED CO., LTD.
    Inventors: Won Il Choi, Sung Hyun Kim, Yong Chul Shin, Jeung Hoon Lee, Jin Hwa Kim, Young Sung Yun
  • Patent number: 11472840
    Abstract: The present disclosure relates to an acetylcholine receptor-binding peptide and, more particularly, to novel peptides which exhibit a wrinkle amelioration effect by binding the peptides to an acetylcholine receptor on which acetylcholine acts, thereby blocking secretion of acetylcholine. Peptides according to the present disclosure suppress secretion of acetylcholine by having a high binding strength with the acetylcholine receptor, thereby strongly binding the peptides to acetylcholine. Therefore, a cosmetic composition and a pharmaceutical composition comprising the peptides according to the present disclosure as an active ingredient exhibit an excellent wrinkle ameliorating effect.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 18, 2022
    Assignee: SKINMED CO., LTD.
    Inventors: Sung Hyun Kim, Won Il Choi, Yong Chul Shin, Jeung Hoon Lee, Young Sung Yun, Jin Hwa Kim
  • Patent number: 9299588
    Abstract: There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: March 29, 2016
    Assignee: HAESUNG DS CO., LTD
    Inventor: Jeung-Il Kim
  • Publication number: 20140329360
    Abstract: There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.
    Type: Application
    Filed: February 18, 2014
    Publication date: November 6, 2014
    Applicant: Samsung Techwin Co., Ltd.
    Inventor: Jeung-Il KIM
  • Patent number: 7952175
    Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: May 31, 2011
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Se-hoon Cho, Jeung-il Kim, Sang-moo Lee
  • Publication number: 20090014854
    Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.
    Type: Application
    Filed: July 2, 2008
    Publication date: January 15, 2009
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Se-hoon Cho, Jeung-il Kim, Sang-moo Lee
  • Patent number: 7341889
    Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: March 11, 2008
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Jeung-Il Kim, Se-hoon Cho
  • Publication number: 20050184364
    Abstract: Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
    Type: Application
    Filed: August 20, 2004
    Publication date: August 25, 2005
    Inventors: Jeung-Il Kim, Se-hoon Cho