Patents by Inventor Jeung-Hoon Kim

Jeung-Hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7640970
    Abstract: An evaporator utilizes micro-channel tubes, and more particularly, has a structure of a heat exchanger using micro-channel tubes, which is applied to an evaporator of a household air conditioner. The evaporator, using micro-channel tubes, includes a first heat exchanging unit including a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward, and a second heat exchanging unit, installed adjacent to the first heat exchanging unit, includes a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward. A plurality of return pipes connect upper headers of neighboring heat exchanging units to transmit refrigerant between the neighboring heat exchanging units.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: January 5, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jeung Hoon Kim, Hong Gi Cho, Seong Ho Kil, Keum Nam Cho, Baek Youn, Hyoung Mo Koo, Jai Kwon Lee
  • Patent number: 6883596
    Abstract: A heater exchanger used to condense a refrigerant in a refrigeration system. The heat exchanger is designed to perform a heat exchanging operation by the use of latent heat of water vaporization, thus having improved heat exchanging efficiency as well as a reduced size. The heat exchanger includes an upper header having a refrigerant inlet port and distributing a refrigerant introduced into the upper header through the refrigerant inlet port, a plurality of heat exchanging tubes connected at upper ends thereof to the upper header and extending in a vertical direction, a lower header connected to lower ends of the heat exchanging tubes and gathering the refrigerant flowing from the heat exchanging tubes, with a refrigerant outlet port formed in the lower header, and a water supply unit assembled with upper portions of external surfaces of the heat exchanging tubes, and feeding water to the tubes to cause water to flow along the external surfaces of the tubes.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: April 26, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeung-Hoon Kim, Baek Youn, Young-Saeng Kim, Hwan-Young Park
  • Publication number: 20040050537
    Abstract: A heater exchanger used to condense a refrigerant in a refrigeration system. The heat exchanger is designed to perform a heat exchanging operation by the use of latent heat of water vaporization, thus having improved heat exchanging efficiency as well as a reduced size. The heat exchanger includes an upper header having a refrigerant inlet port and distributing a refrigerant introduced into the upper header through the refrigerant inlet port, a plurality of heat exchanging tubes connected at upper ends thereof to the upper header and extending in a vertical direction, a lower header connected to lower ends of the heat exchanging tubes and gathering the refrigerant flowing from the heat exchanging tubes, with a refrigerant outlet port formed in the lower header, and a water supply unit assembled with upper portions of external surfaces of the heat exchanging tubes, and feeding water to the tubes to cause water to flow along the external surfaces of the tubes.
    Type: Application
    Filed: January 17, 2003
    Publication date: March 18, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeung-Hoon Kim, Baek Youn, Young-Saeng Kim, Hwan-Young Park
  • Publication number: 20040007349
    Abstract: A heater exchanger used to condense a refrigerant in a refrigeration system. The heat exchanger is designed to perform a heat exchanging operation by the use of latent heat of water vaporization, thus having improved heat exchanging efficiency as well as a reduced size.
    Type: Application
    Filed: October 24, 2002
    Publication date: January 15, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Baek Youn, Jeung-Hoon Kim, Young-Saeng Kim