Patents by Inventor Jeurgen Leib

Jeurgen Leib has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130137259
    Abstract: A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.
    Type: Application
    Filed: January 8, 2013
    Publication date: May 30, 2013
    Applicant: WAFER-LEVEL PACKAGING PORTFOLIO LLC
    Inventors: Florian Bieck, Jeurgen Leib