Patents by Inventor Jhang-Jie JIAN

Jhang-Jie JIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer processing system and method
    Patent number: 11901207
    Abstract: A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Kai-Hung Hsiao, Chi-Chung Jen, Yu-Chun Shen, Jhang-Jie Jian, Wen-Chih Chiang
  • SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD
    Publication number: 20220406639
    Abstract: A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 22, 2022
    Inventors: Kai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Jhang-Jie JIAN, Wen-Chih CHIANG