Patents by Inventor Jhao-Siang Jheng

Jhao-Siang Jheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal circuit on polymer composite substrate surface and method for manufacturing the same
    Patent number: 11310916
    Abstract: A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 19, 2022
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Jhao-Siang Jheng, Chun-Lung Wu