Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

Abstract: A method of making a strain wave includes the steps of a) providing a circular spline, a flexspline meshed with the circular spline, and an initial wave generator having an initial outer profile of a standard ellipse with a perimeter S0, and b) producing a modified wave generator rotatably fitted within the flexspline and having a modified outer profile with a perimeter S. A difference ES between the perimeter S of the modified outer profile and the perimeter S0 of the initial outer profile satisfies the equation ES=S?S0=0.1 m to 0.8 m, wherein m is the modulus of the flexspline. Through a special parameter design of the modified wave generator, the meshing ratio between the circular spline and the flexspline is increased, thereby improving the transmission accuracy and reducing the average load.

Abstract: A method of making a strain wave includes the steps of a) providing a circular spline, a flexspline meshed with the circular spline, and an initial wave generator having an initial outer profile of a standard ellipse with a perimeter S0, and b) producing a modified wave generator rotatably fitted within the flexspline and having a modified outer profile with a perimeter S. A difference ES between the perimeter S of the modified outer profile and the perimeter S0 of the initial outer profile satisfies the equation ES=S?S0=0.1 m to 0.8 m, wherein m is the modulus of the flexspline. Through a special parameter design of the modified wave generator, the meshing ratio between the circular spline and the flexspline is increased, thereby improving the transmission accuracy and reducing the average load.

Abstract: A harmonic drive includes a circular spline, a flexspline meshed with the circular spline, and a wave generator abutted against the flexspline. Through a special parameter design to correct the perimeter curve of the wave generator, the meshing efficiency between the circular spline and the flexspline is increased, thereby improving the transmission accuracy and reducing the average load.