Patents by Inventor Jhee-Mann Kim
Jhee-Mann Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11872785Abstract: A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.Type: GrantFiled: January 19, 2022Date of Patent: January 16, 2024Assignee: Corning IncorporatedInventors: Jhee-mann Kim, Goo-Soo Lee
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Publication number: 20220347969Abstract: Provided is a glass laminate article including a core substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; a first metal sheet on the first surface; a second metal sheet on the second surface; a glass substrate on the second metal sheet; and an adhesive member bonding the glass substrate to the second metal sheet, wherein the core substrate has lower thermal conductivity than a medium density fiberboard (MDF).Type: ApplicationFiled: October 22, 2020Publication date: November 3, 2022Inventors: Jhee-mann Kim, Goo Soo Lee
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Publication number: 20220134711Abstract: A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.Type: ApplicationFiled: January 19, 2022Publication date: May 5, 2022Inventors: Jhee-mann Kim, Goo-Soo Lee
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Patent number: 11247435Abstract: A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.Type: GrantFiled: August 30, 2017Date of Patent: February 15, 2022Assignee: Corning IncorporatedInventors: Jhee-mann Kim, Goo-Soo Lee
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Publication number: 20210245477Abstract: A glass lamination article includes a resin layer in contact with a base substrate such that a first interface is formed therebetween, and a glass substrate layer in contact with the resin layer such that a second interface is formed therebetween, wherein the resin layer may be an ultraviolet (UV)-curable resin layer. The glass lamination article has excellent impact resistance and strength, as well as excellent waviness.Type: ApplicationFiled: June 18, 2019Publication date: August 12, 2021Inventors: Jhee-mann Kim, Joon-Soo Kim, Goo Soo Lee
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Publication number: 20200338854Abstract: A laminated glass structure is provided that includes: a substrate comprising a primary surface and a thickness from about 0.5 mm to about 50 mm; an adhesive having an elastic modulus, Eadhesive, of about 0.001 MPa to 0.2 MPa; and a flexible glass sheet having a thickness, tglass, of no greater than about 300 ?m. The flexible glass sheet is laminated to the primary surface of the substrate with the adhesive. Further, a thickness of the adhesive, tadhesive, IS given by the following: tadhesive>?×AWt×(200\imltglass)×(Eadhesive 10.1 MPa), where ? is a waviness constant set at 150 and AWt is a delta total waviness (?m), the delta total waviness, AWt, ranges from about 0.125 ??? to 2.5 ??? and is defined as the difference between a waviness of the substrate and a waviness of the glass sheet.Type: ApplicationFiled: October 19, 2018Publication date: October 29, 2020Inventors: Jhee-mann Kim, Joon-Soo Kim, Goo Soo Lee
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Publication number: 20190184683Abstract: A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.Type: ApplicationFiled: August 30, 2017Publication date: June 20, 2019Inventors: Jhee-mann Kim, Goo-Soo Lee
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Patent number: 10211377Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.Type: GrantFiled: March 25, 2015Date of Patent: February 19, 2019Assignee: Corning Precision Materials Co., Ltd.Inventors: Yoon Seuk Oh, Ki Yeon Lee, Hyung Soo Moon, Bo Mi Kim, Jhee Mann Kim, Cheol Min Park, Choon Bong Yang
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Patent number: 10141481Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.Type: GrantFiled: March 24, 2015Date of Patent: November 27, 2018Assignee: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Jhee Mann Kim, Hyung Soo Moon, Yoon Seuk Oh, Choon Bong Yang
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Patent number: 9893245Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.Type: GrantFiled: March 17, 2015Date of Patent: February 13, 2018Assignee: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Hyung Soo Moon, Yoon Seuk Oh, Jhee Mann Kim, Choon Bong Yang
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Patent number: 9893248Abstract: The present invention relates to a substrate for changing the color of a light emitting diode and a method for producing same and, more particularly, to a substrate for changing the color of a light emitting diode and a method for producing same, wherein the substrate may be hermetically sealed so that quantum dots (QD) contained inside may be completely protected from the outside and emission efficiency of the light emitting diode may be enhanced.Type: GrantFiled: March 25, 2015Date of Patent: February 13, 2018Assignee: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Yoon Seuk Oh, Jhee Mann Kim, Hyung Soo Moon, Choon Bong Yang
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Publication number: 20170197867Abstract: The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the present invention provides a hermetic sealing method comprising: a substrate preparation step for preparing a first substrate and a second substrate smaller than the first substrate; a glass frit paste applying step for applying the glass frit paste such that the glass frit paste adheres to the upper periphery of the first substrate and a side of the second substrate while the first and second substrates are disposed to face each other; and a laser irradiation step for irradiating a laser beam to the applied glass frit paste to hermetically seal the space between the first and second substrates.Type: ApplicationFiled: May 11, 2015Publication date: July 13, 2017Applicant: Corning Precision Materials Co., Ltd.Inventors: Choon Bong Yang, Ki Yeon Lee, Bo Mi Kim, Jhee Mann Kim, Yoon Seuk Oh
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Patent number: 9656908Abstract: The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.Type: GrantFiled: June 12, 2013Date of Patent: May 23, 2017Assignee: Corning Precision Materials Co., Ltd.Inventors: Kiyeon Lee, Jhee-Mann Kim, Jaemin Cha, Jaeho Lee
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Patent number: 9656907Abstract: A low expansion glass filler which minimizes reflection of laser light during hermetic sealing, a method of manufacturing the same and a glass frit including the same. The low expansion glass filler includes SiO2, Al2O3, B2O3 and CaCO3, the transmittance of the low expansion glass filler being 80% or greater at a wavelength ranging from 630 to 920 nm.Type: GrantFiled: October 21, 2013Date of Patent: May 23, 2017Assignee: Corning Precision Materials Co., Ltd.Inventors: Jhee-Mann Kim, Kiyeon Lee, Jaemin Cha, Jaeho Lee
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Publication number: 20170077363Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package.Type: ApplicationFiled: March 25, 2015Publication date: March 16, 2017Applicant: Corning Precision Materials Co., Ltd.Inventors: Yoon Seuk Oh, Ki Yeon Lee, Hyung Soo Moon, Bo Mi Kim, Jhee Mann Kim, Cheol Min Park, Choon Bong Yang
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Publication number: 20170040507Abstract: The present invention relates to a substrate for changing the color of a light emitting diode and a method for producing same and, more particularly, to a substrate for changing the color of a light emitting diode and a method for producing same, wherein the substrate may be hermetically sealed so that quantum dots (QD) contained inside may be completely protected from the outside and emission efficiency of the light emitting diode may be enhanced. Thus, the present invention provides a substrate for changing the color of a light emitting diode, and a method for producing same, wherein the substrate is characterized by including: a first glass substrate disposed on the light emitting diode; a second glass substrate formed opposite to the first substrate; a structure which is disposed between the first substrate and the second substrate, has hollows, and includes a material having a coefficient of thermal expansion (CTE) of 30-80×10?7/° C.Type: ApplicationFiled: March 25, 2015Publication date: February 9, 2017Applicant: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Yoon Seuk Oh, Jhee Mann Kim, Hyung Soo Moon, Choon Bong Yang
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Publication number: 20170040511Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.Type: ApplicationFiled: March 24, 2015Publication date: February 9, 2017Applicant: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Jhee Mann Kim, Hyung Soo Moon, Yoon Seuk Oh, Choon Bong Yang
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Publication number: 20170025584Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.Type: ApplicationFiled: March 17, 2015Publication date: January 26, 2017Applicant: Corning Precision Materials Co., Ltd.Inventors: Ki Yeon Lee, Hyung Soo Moon, Yoon Seuk Oh, Jhee Mann Kim, Choon Bong Yang
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Publication number: 20150166404Abstract: The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.Type: ApplicationFiled: June 12, 2013Publication date: June 18, 2015Applicant: Corning Precision Materials Co., Ltd.Inventors: Kiyeon Lee, Jhee-Mann Kim, Jaemin Cha, Jaeho Lee
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Patent number: 9034565Abstract: A substrate for an organic light-emitting device which can improve the light extraction efficiency of an organic light-emitting device while realizing an intended level of transmittance, a method of fabricating the same, and an organic light-emitting device having the same. Light emitted from the OLED is emitted outward through the substrate. The substrate includes a substrate body and a number of crystallized particles disposed inside the substrate body, the number of crystallized particles forming a pattern inside the substrate body.Type: GrantFiled: May 2, 2014Date of Patent: May 19, 2015Assignee: Samsung Corning Precision Materials Co., Ltd.Inventors: Kiyeon Lee, Jhee-Mann Kim, Youngseok Lee, Kyungmin Yoon, Jaeho Lee