Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material. The blue light blocking material covers the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The contact lens has good blue light blocking efficacy and surface properties.

Abstract: Provided is a method for diagnosing and monitoring progression of cancer or effectiveness of a therapeutic treatment. The method includes detecting a methylation level of at least one gene in a biological sample containing circulating free DNA. Also provided are primer pairs and probes for diagnosis or prognosis of cancer in a subject in need thereof.

Abstract: The present invention relates to a display device, which includes a backlight module, an active dimming layer, a liquid crystal display panel, and a moire elimination layer. The active dimming layer is arranged on the light emitting surface of the backlight module, and includes a plurality of dimming sub-regions that can change the light polarization directions. The liquid crystal display panel is arranged on the light exiting surface of the active dimming layer. The moire elimination layer is arranged on the outer surface of the liquid crystal display panel. The display device can improve the optical interference phenomenon through the moire elimination layer, and has a better contrast gain effect.

Abstract: A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.

Abstract: A liquid cooling device includes a liquid cooling conductor, a detecting probe, and a determining circuit. The liquid cooling conductor includes a chamber defined therein for communicating with the outside, the chamber is configured to accommodate the coolant, and the surface of the liquid cooling conductor is provided with at least one communicating port communicating with the chamber; wherein the liquid cooling conductor is formed joining at least two combination blocks, and at least one of the two combination blocks is a metal conductor. The detecting probe is disposed on the liquid cooling conductor and normally electrically disconnected from the metal conductor. The determining circuit is electrically connected to the metal conductor and the detecting probe, and generates a liquid leakage alarm signal when the metal conductor and the detecting probe are electrically connected.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.

Abstract: An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module.

Abstract: The invention discloses a polarizer comprising a first protective layer, a second protective layer, and a polarizing layer sandwiched therebetween. The polarizing layer comprises a first polarizing area and a second polarizing area with different polarizations. The polarization degree of the first polarizing area is greater than 99.9% and less than 100%, and the light transmittance is between 40% and 45%; the polarization degree of the second polarizing area is not less than 90% and not greater than 99.9%, and the light transmittance is between 45% to 48%. The disclosed polarizer can be used in an electronic device with an integrated camera module.

Abstract: A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated with the first region. The partition structure includes a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region to separate a first flow path and a second flow path disposed in left and right portions in the first region. The separation layer is horizontally disposed in the second region to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region.

Abstract: A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.

Abstract: A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated with the first region. The partition structure includes a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region to separate a first flow path and a second flow path disposed in left and right portions in the first region. The separation layer is horizontally disposed in the second region to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region.

Abstract: A computer system and a handling method thereof for an interrupt event are provided. The computer system includes an embedded controller, a system memory, and a processing unit. The embedded controller has an internal memory and triggers an interrupt event. The processing unit is coupled to the embedded controller and the system memory, and receives a notification of the interrupt event. In response to the interrupt event, the processing unit reads an event identifier corresponding to the interrupt event at a specific address section in the internal memory or maps the event identifier corresponding to the interrupt event at the specific address section in the internal memory of the embedded controller to the system memory. The processing unit notifies a hardware driver program corresponding to the event identifier. Accordingly, efficiency of handling the interrupt event is effectively enhanced.

Abstract: A method for treatment of a hexachlorodisilane and its hydrolyzed product is disclosed. It comprises adding a hexachlorodisilane or its hydrolyzed product into a sulfuric acid solution for reaction.

Abstract: A liquid cooling device includes a liquid cooling conductor, a detecting probe, and a determining circuit. The liquid cooling conductor includes a chamber defined therein for communicating with the outside, the chamber is configured to accommodate the coolant, and the surface of the liquid cooling conductor is provided with at least one communicating port communicating with the chamber; wherein the liquid cooling conductor is formed joining at least two combination blocks, and at least one of the two combination blocks is a metal conductor. The detecting probe is disposed on the liquid cooling conductor and normally electrically disconnected from the metal conductor. The determining circuit is electrically connected to the metal conductor and the detecting probe, and generates a liquid leakage alarm signal when the metal conductor and the detecting probe are electrically connected.

Abstract: A method for treatment of a hexachlorodisilane and its hydrolyzed product is disclosed. It comprises adding a hexachlorodisilane or its hydrolyzed product into a sulfuric acid solution for reaction.

Abstract: A computer system and a handling method thereof for an interrupt event are provided. The computer system includes an embedded controller, a system memory, and a processing unit. The embedded controller has an internal memory and triggers an interrupt event. The processing unit is coupled to the embedded controller and the system memory, and receives a notification of the interrupt event. In response to the interrupt event, the processing unit reads an event identifier corresponding to the interrupt event at a specific address section in the internal memory or maps the event identifier corresponding to the interrupt event at the specific address section in the internal memory of the embedded controller to the system memory. The processing unit notifies a hardware driver program corresponding to the event identifier. Accordingly, efficiency of handling the interrupt event is effectively enhanced.

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorentz force to drive the movable carrier element to move against the return force of the two return springs.

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorenz force to drive the movable carrier element to move against the return force of the two return springs.

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorentz force to drive the movable carrier element to move against the return force of the two return springs.

Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorenz force to drive the movable carrier element to move against the return force of the two return springs.