Abstract: An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 ?m to 1.5 ?m. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 ?m to 30 ?m.

Abstract: A method of manufacturing a copper foil for a high frequency circuit includes sequentially forming a fine roughness copper nodule layer on a surface of an electroplated copper layer, the fine roughness copper nodule layer being consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; then, performing electroplating with a Zn—Ni co-electroplating formula for 3 seconds or more to form a Zn—Ni plating layer on the fine roughness copper nodule layer, the Zn—Ni plating layer including 90-150 ?g/dm2 of zinc and 75-120 ?g/dm2 of nickel; forming a rust-proof layer on the Zn—Ni plating layer, the rust-proof layer including 20-40 ?g/dm2 of chromium; and next, forming a hydrophobic layer on the rust-proof layer, the hydrophobic layer having a water contact angle of 80 to 150 degrees.

Abstract: A composite laminate includes a metal foil layer, a silane layer, a strengthening adhesive layer, and a hydrocarbon resin layer. The silane layer is disposed between the metal foil layer and the hydrocarbon resin layer. The strengthening adhesive layer is disposed between the silane layer and the hydrocarbon resin layer.

Abstract: An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 ?m to 1.5 ?m. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 ?m to 30 ?m.

Abstract: A copper foil and a manufacturing method of the same, and a current collector of an energy storage device are provided. The manufacturing method includes forming a copper foil by direct-current electroplating on a surface of a cathode and separating the copper foil from the cathode after the electroplating, wherein the structure of the copper foil includes columnar grains of a (111) orientation having a volume ratio of 70% or more. The conditions of the direct-current electroplating include performing at a range of 35° C. to 55° C. using a plating solution containing 40 g/L to 120 g/L of copper ions, 40 g/L to 110 g/L of sulfuric acid, and 30 ppm to 90 ppm of chloride ions at a current density between 20 ASD and 60 ASD.

Abstract: A copper foil for a high frequency circuit and a method of manufacturing the same are provided. The copper foil for a high frequency circuit includes an electroplated copper layer, a fine roughness copper nodule layer, a Zn—Ni plating layer, a rust-proof layer, and a hydrophobic layer. The fine roughness copper nodule layer is located on a surface of the electroplated copper layer and is consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm. The Zn—Ni plating layer is located on the fine roughness copper nodule layer and includes 90-150 ?g/dm2 of zinc and 75-120 ?g/dm2 of nickel. The rust-proof layer is located on the Zn—Ni plating layer and includes 20-40 ?g/dm2 of chromium. The hydrophobic layer is located on the rust-proof layer and has a contact angle of 80 to 150 degrees.

Abstract: A composite laminate includes a metal foil layer, a silane layer, a strengthening adhesive layer, and a hydrocarbon resin layer. The silane layer is disposed between the metal foil layer and the hydrocarbon resin layer. The strengthening adhesive layer is disposed between the silane layer and the hydrocarbon resin layer.