Patents by Inventor Jheng-Yi Li

Jheng-Yi Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250142917
    Abstract: A composite structure includes a dielectric layer, a two-dimensional graphene layer and a carbon quantum dot film. The dielectric layer is disposed on a first surface of a silicon substrate. The two-dimensional graphene layer is disposed on the dielectric layer. The carbon quantum dot film is disposed on the two-dimensional graphene layer.
    Type: Application
    Filed: December 14, 2023
    Publication date: May 1, 2025
    Applicant: National Cheng Kung University
    Inventors: Chia-Yun CHEN, Zhe-Hao LIU, Kuan-Han LIN, Jheng-Yi LI
  • Publication number: 20240414931
    Abstract: An organic/inorganic composite structure includes a silicon substrate and a conductive polymer layer. The silicon substrate includes a plurality of microstructures disposed on a surface of the silicon substrate. The conductive polymer layer is disposed on the plurality of microstructures. A spaced distance is between the conductive polymer layer and the surface of the silicon substrate.
    Type: Application
    Filed: July 28, 2023
    Publication date: December 12, 2024
    Applicant: National Cheng Kung University
    Inventors: Chia-Yun Chen, Jheng-Yi Li, Tsung-Yen Wu