Patents by Inventor Jheng-Yu HONG

Jheng-Yu HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for manufacturing a semiconductor package structure
    Patent number: 12183712
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: December 31, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
  • METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20230138460
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Application
    Filed: December 27, 2022
    Publication date: May 4, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
  • Method and system for manufacturing a semiconductor package structure
    Patent number: 11538787
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: December 27, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
  • METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220139872
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU