Abstract: A frameless panel light includes a light source module and a lamp cover having a front portion and side portions surrounding the front portion. The front and side portions define an accommodating space. The light source module is disposed in the accommodating space and includes a light source and a light guide plate. The light guide plate includes a light-transmissive substrate including first and second major surfaces and a side surface connecting the first and second major surfaces and a microstructure formed on the first major surface and including a recess and an annular groove around the recess. The annular groove has a depth greater than that of the recess. A bottom of the recess is at higher elevation than the first major surface from the second major surface. The annular groove has a protruding portion protruding from a bottom of the annular groove.

Abstract: A light guide plate includes a light-transmissive substrate and at least one microstructure. The light-transmissive substrate includes first and second major surfaces and a side surface connecting the first and second major surfaces. The microstructure is formed on the first major surface. The microstructure comprises a recess and an annular groove around the recess. The annular groove has a depth greater than a depth of the recess. A bottom of the recess is at higher elevation than the first major surface from the second major surface.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: A semiconductor light emitting structure includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer and two electrodes. The substrate has a top surface and a bottom surface. The top surface is not parallel to the bottom light emitting surface of the active layer. The first semiconductor layer is disposed on the top surface. The active layer is disposed on at least one portion of the first semiconductor layer. The second semiconductor layer is disposed on the active layer. In an embodiment, the top surface can be realized by an oblique surface, a curved surface or a zigzag surface.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: A light emitting module includes a substrate, a conductive layer, a first light emitter, a second light emitter and a protection layer. The substrate has a first surface and a second surface on opposite sides of the substrate. The conductive layer is configured in the substrate. The first light emitter is disposed on the first surface and connected with the conductive layer. The second light emitter is disposed on the second surface and connected with the conductive layer. The protection layer covers the first light emitter and the second light emitter.

Abstract: A food box with flatware attached thereon. The food box has an attached sheet extending from each of the at least one side sheet of the upper cover body thereof, which covers the box body of the food box from above. The attached sheet is refolded to form an attached flatware portion, together with the side sheet, wherein the attached flatware portion has pressure-made creases thereon of predetermined shapes, according to the outline of ordinary flatware including chopsticks, forks and spoons. The user may take off and obtain at least one disposable flatware piece and strip the residual material along the crease. Furthermore, easy and efficient use can be achieved by using appropriate thickness of material.