Patents by Inventor Jhih-Jhe Wang

Jhih-Jhe Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240224804
    Abstract: A sampling front-end for analog to digital converter is presented that shares a high speed N-bit ADC at front-end and interleaves the pipelined residue amplification with shared amplifier, which achieves high speed, low power and compact area with high density capacitive DAC structure.
    Type: Application
    Filed: January 3, 2023
    Publication date: July 4, 2024
    Inventors: Jhih-Jhe WANG, Sung-Cheng LO, Chun-Kai CHAN, Cheng-Syun LI, Ming-Ching CHENG, Yu-Chen CHEN, Hsu-Hsiang CHENG
  • Publication number: 20190064011
    Abstract: A flexible sensor including a polymer substrate, four polymer sensor units, a polymer bump, and a plurality of conductive patterns is provided. The polymeric sensor units are embedded in the polymer substrate, wherein one pair of the polymer sensor units are located at two opposite sides of the polymer substrate in a first direction, and the other pair of the polymer sensor units are located at two opposite sides of the polymer substrate in a second direction perpendicular to the first direction. The polymer bump is disposed on the polymer substrate and covers the four polymer sensor units. The conductive patterns are disposed on the polymer substrate and respectively connected to the corresponding polymer sensor unit.
    Type: Application
    Filed: October 17, 2017
    Publication date: February 28, 2019
    Applicant: National Tsing Hua University
    Inventors: Jhih-Jhe Wang, Wei-Leun Fang
  • Patent number: 9048427
    Abstract: The present invention is related to a thin film fabrication of a rubber material with piezoelectric characteristics and a manufacturing method thereof. The present invention is developed by utilizing polymer casting, multilayer stacking, surface coating, and micro plasma discharge processes. To realize the desired electromechanical sensitivity, cellular PDMS structures with micrometer-sized voids are implanted with bipolar charges on the opposite inner surfaces. The implanted charge pairs function as dipoles, which respond promptly to diverse electromechanical simulation.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: June 2, 2015
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yu-Chuan Su, Jhih-Jhe Wang
  • Publication number: 20140252915
    Abstract: The present invention is related to a thin film fabrication of a rubber material with piezoelectric characteristics and a manufacturing method thereof. The present invention is developed by utilizing polymer casting, multilayer stacking, surface coating, and micro plasma discharge processes. To realize the desired electromechanical sensitivity, cellular PDMS structures with micrometer-sized voids are implanted with bipolar charges on the opposite inner surfaces. The implanted charge pairs function as dipoles, which respond promptly to diverse electromechanical simulation.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yu-Chuan Su, Jhih-Jhe Wang