Patents by Inventor Jhih-Yong Yang

Jhih-Yong Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240372053
    Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer and a plurality of mesas spaced apart from each other on the first semiconductor layer, wherein the plurality of mesas each includes a second semiconductor layer, the first semiconductor layer and the second semiconductor layer have different conductivity types; a contact metal formed on the semiconductor stack, including a plurality of first contact parts located between the mesas and electrically connected to the first semiconductor layer, and a plurality of second contact parts located on the mesas and electrically connected to the second semiconductor layer; a first insulating structure formed on the contact metal, including a plurality of first openings corresponding to the first contact parts and a plurality of second openings corresponding to the second contact parts; a current spreading electrode formed on the first insulating structure, including a first current spreader and a plurality of second current sp
    Type: Application
    Filed: May 3, 2024
    Publication date: November 7, 2024
    Inventors: Hsin-Ying WANG, Jhih-Yong YANG, Chien-Chih LIAO, Chao-Hsing CHEN, Jheng-Long HUANG, Ching-Hsing SHEN, Hui-Fang KAO
  • Publication number: 20240339345
    Abstract: A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.
    Type: Application
    Filed: June 20, 2024
    Publication date: October 10, 2024
    Inventors: Min-Hsun HSIEH, De-Shan KUO, Chang-Lin LEE, Jhih-Yong YANG
  • Patent number: 12057337
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: August 6, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, De-Shan Kuo, Chang-Lin Lee, Jhih-Yong Yang
  • Publication number: 20240113262
    Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, an active region and a second semiconductor layer; a first contact electrode and a second contact electrode formed on the semiconductor stack, wherein the first contact electrode includes a first contact part formed on the first semiconductor layer and the second contact electrode includes a second contact part formed on the second semiconductor layer; an insulating stack formed on the semiconductor stack, including an opening on the second contact part; a first electrode pad and a second electrode pad formed on the insulating stack, wherein the second electrode pad filled in the opening and connecting the second contact part; wherein the second electrode pad includes an upper surface, and the upper surface includes a platform area and a depression area on the second contact part; wherein the platform area has a maximum height relative to other areas of the upper surface; wherein an area of a projection of the plat
    Type: Application
    Filed: September 1, 2023
    Publication date: April 4, 2024
    Inventors: Hsin-Ying WANG, Hui-Chun YEH, Jhih-Yong YANG, Chen OU, Cheng-Lin LU
  • Publication number: 20230317912
    Abstract: A light-emitting diode, includes a semiconductor stack, including a first semiconductor layer, an active region and a second semiconductor layer; a transparent conductive layer formed on the semiconductor stack and electrically connected to the second semiconductor layer; an insulating layer formed on the transparent conductive layer, comprising a plurality of first opening; a first electrode formed on the insulating layer, electrically connected to the first semiconductor layer; and a second electrode formed on the insulating layer, comprising a second pad and a second extension extending from the second pad along a long side of the light-emitting diode toward the first electrode, electrically connected to the transparent conductive layer, wherein the second extension comprise a plurality of node parts and a plurality of linking parts alternately disposed, and in a plan view, the node part has a width smaller than that of the second pad and lager than that of the linking part and that of the first opening; w
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: Jhih Yong YANG, Hsin Ying WANG, De Shan KUO
  • Publication number: 20230274962
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion chips from the first load-bearing structure; dividing the first portion chips into a plurality of blocks according to the photoelectric characteristic values, and each of the plurality of blocks comprising multiple chips of the first portion chips; and transferring the multiple chips of one of the plurality of blocks to a second load-bearing structure.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Inventors: Min-Hsun HSIEH, De-Shan KUO, Chang-Lin LEE, Jhih-Yong YANG
  • Patent number: 11658052
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: May 23, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, De-Shan Kuo, Chang-Lin Lee, Jhih-Yong Yang
  • Publication number: 20210336090
    Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 28, 2021
    Inventors: Jhih-Yong YANG, Hsin-Ying WANG, De-Shan KUO, Chao-Hsing CHEN, Yi-Hung LIN, Meng-Hsiang HONG, Kuo-Ching HUNG, Cheng-Lin LU
  • Publication number: 20210335641
    Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.
    Type: Application
    Filed: July 2, 2021
    Publication date: October 28, 2021
    Inventors: Min-Hsun HSIEH, De-Shan KUO, Chang-Lin LEE, Jhih-Yong YANG
  • Patent number: 11056368
    Abstract: A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: July 6, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, De-Shan Kuo, Chang-Lin Lee, Jhih-Yong Yang
  • Publication number: 20200373472
    Abstract: A light-emitting diode, includes a semiconductor stack, including a first semiconductor layer, an active region, and a second semiconductor layer; a transparent conductive layer formed on the semiconductor stack and electrically connected to the second semiconductor layer; an insulating layer formed on the transparent conductive layer, including a first opening; and an electrode layer formed on the insulating layer, including a first pad and a first extension extending from the first pad; wherein the first extension contacts the transparent conductive layer through the first opening and covers the entire first opening.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Inventors: Jhih Yong Yang, Hsin Ying Wang, De Shan Kuo
  • Patent number: 10490598
    Abstract: A light-emitting structure, comprising: a first light-emitting structure unit and a second light-emitting structure unit, adjacent to and spaced apart from each other; and an electrical connection arranged on the first light-emitting structure unit and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light emitting structure unit; wherein the first light-emitting structure unit comprises a first side surface and a second side surface; wherein the first side surface is between the first and the second light-emitting structure units, and the second side surface is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the first side surface is inclined and a slope of the first side surface is gentler than a slope of the second side surface.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: November 26, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Jhih-Yong Yang, Hui-chun Yeh, Chien-Fu Shen, Tsun-Kai Ko
  • Publication number: 20190229001
    Abstract: A transferring chips method, including providing a plurality of chips on a first load-bearing structure; dividing the first load-bearing structure into a plurality of blocks, and each of the plurality of blocks including multiple chips of the plurality of chips; measuring a characteristic value of each of the plurality of chips; respectively calculating an average characteristic value of each of the plurality of blocks based on the characteristic values of the multiple chips of each of the plurality of blocks; and transferring the multiple chips of at least two blocks of the plurality of blocks with the average characteristic values within the same range to a second load-bearing structure.
    Type: Application
    Filed: January 25, 2019
    Publication date: July 25, 2019
    Inventors: Min-Hsun HSIEH, De-Shan KUO, Chang-Lin LEE, Jhih-Yong YANG
  • Publication number: 20170263674
    Abstract: A light-emitting structure, comprising: a first light-emitting structure unit and a second light-emitting structure unit, adjacent to and spaced apart from each other; and an electrical connection arranged on the first light-emitting structure unit and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light emitting structure unit; wherein the first light-emitting structure unit comprises a first side surface and a second side surface; wherein the first side surface is between the first and the second light-emitting structure units, and the second side surface is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the first side surface is inclined and a slope of the first side surface is gentler than a slope of the second side surface.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 14, 2017
    Inventors: Jhih-Yong YANG, Hui-chun YEH, Chien-Fu SHEN, Tsun-Kai KO
  • Patent number: D790488
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: June 27, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko
  • Patent number: D795206
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: August 22, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko
  • Patent number: D797064
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: September 12, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko
  • Patent number: D797065
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: September 12, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko
  • Patent number: D797689
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: September 19, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko
  • Patent number: D844575
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: April 2, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Chun Yeh, Jhih-Yong Yang, Chien-Fu Shen, Tsun-Kai Ko