Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

Abstract: Differing from conventional directional coupling device being implemented on a coin-like planar board, the present invention stacks a bottom substrate, at least one phase retarding unit, at least one reference ground unit, a coupled circuit layer, a main circuit layer, and a top substrate to form a miniature directional coupling device. Because this miniature directional coupling device not occupies too much circuit area when being applied in a mobile communication product, the miniature directional coupling device can meet the requirements of light weight and compact size demanded by high-technology mobile communications for the electronic components. It is worth explaining that, since the said phase retarding unit consists of many end-to-end connected transmission wires, engineers skilled in designing microwave circuit are able to carry out the modulation of coupling flatness of the miniature directional coupling device by changing a total length of the end-to-end connected transmission wires.

Abstract: Differing from conventional directional coupling device being implemented on a coin-like planar board, the present invention stacks a bottom substrate, at least one phase retarding unit, at least one reference ground unit, a coupled circuit layer, a main circuit layer, and a top substrate to form a miniature directional coupling device. Because this miniature directional coupling device not occupies too much circuit area when being applied in a mobile communication product, the miniature directional coupling device can meet the requirements of light weight and compact size demanded by high-technology mobile communications for the electronic components. It is worth explaining that, since the said phase retarding unit consists of many end-to-end connected transmission wires, engineers skilled in designing microwave circuit are able to carry out the modulation of coupling flatness of the miniature directional coupling device by changing a total length of the end-to-end connected transmission wires.