Patents by Inventor Jhong-Yan Chang
Jhong-Yan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150139833Abstract: A thin-profile cross-flow fan with air volume gain effect has a thin-profile casing, a cross-flow guide passage, a blade assembly, an auxiliary guide ring portion, an axial magnetic motor and a radial flow-through auxiliary guide portion. When the thin-profile cross-flow fan is operated, the air stream guided from the air inlet can be guided to the air outlet through the circulation space or the auxiliary guide ring portion and radial flow-through the auxiliary guide portion, thus increasing the an flux and volume of the thin-profile cross-flow fan and also improving greatly its gain effect and performance with better applicability and industrial benefits.Type: ApplicationFiled: November 15, 2013Publication date: May 21, 2015Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Sin-Wei He, Chih-Ren Huang, Jhong-Yan Chang
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Publication number: 20150114608Abstract: An electrostatic air-cooled heat sink has a frame, a power controller, a sharp electrode with a sharp electrode portion, a through-hole, a guide frame, a half-bowl blunt electrode assembly and flow-through portion. The electrostatic air-cooled heat sink features a simple and lightweight structure, making it suitable for mass production and beat radiation with better applicability and industrial benefits.Type: ApplicationFiled: October 30, 2013Publication date: April 30, 2015Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Sin-Wei He, Jhong-Yan Chang, Chih-Ren Huang
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Patent number: 8720062Abstract: A molding method for a thin-profile composite capillary structure includes the steps of preparing a metal grid and metal powder separately; attaching a liquid medium onto the metal grid by means of spraying or brushing or steeping; attaching uniformly the metal powder onto the grid with the liquid medium; and fixing the metal powder onto the surface of the grid by means of sintering, such that a sintered powder layer is formed onto the surface of the grid. The structure includes a metal grid, which is of planar grid pattern made of woven metal wires. A sintered powder layer is sintered onto a lateral surface of the metal grid from the metal powder. The thickness of the sintered powder layer is 0.1 mm-0.7 mm. The total thickness of the thin-profile composite capillary structure is 0.2 mm-0.8 mm, thus presenting flexibility. The thin-profile composite capillary structure is particularly suitable for a heat pipe.Type: GrantFiled: January 9, 2012Date of Patent: May 13, 2014Assignee: Forcecon Technology Co., Ltd.Inventors: Sin-Wei He, Jhong-Yan Chang, Yen-Chen Chen
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Publication number: 20130174958Abstract: A molding method for a thin-profile composite capillary structure includes the steps of preparing a metal grid and metal powder separately; attaching a liquid medium onto the metal grid by means of spraying or brushing or steeping; attaching uniformly the metal powder onto the grid with the liquid medium; and fixing the metal powder onto the surface of the grid by means of sintering, such that a sintered powder layer is formed onto the surface of the grid. The structure includes a metal grid, which is of planar grid pattern made of woven metal wires. A sintered powder layer is sintered onto a lateral surface of the metal grid from the metal powder. The thickness of the sintered powder layer is 0.1 mm-0.7 mm. The total thickness of the thin-profile composite capillary structure is 0.2 mm-0.8 mm, thus presenting flexibility. The thin-profile composite capillary structure is particularly suitable for a heat pipe.Type: ApplicationFiled: January 9, 2012Publication date: July 11, 2013Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Sin-Wei He, Jhong - Yan Chang, Yen-Chen Chen
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Publication number: 20130174966Abstract: A molding method of the heat pipe for capillary structure with controllable sintering position wherein said heat pipe is fabricated by said pipe body, grid-sintered composite capillary structure, core rod, evaporation section sintered capillary structure and powder limiting grid. This allows fabrication of the evaporation section sintered capillary structure with the help of the powder limiting grid, such that the capillary structure could be molded more easily while controlling accurately the sintering position and range. Moreover, with embedding of said grid-sintered composite capillary structure, the steam flow channel of the heat pipe could be further expanded and adapted to the flexible processing of the pipe wall, thus facilitating the fabrication and improving the vaporization efficiency of the working fluid with better applicability and industrial benefits.Type: ApplicationFiled: January 11, 2012Publication date: July 11, 2013Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Sin-Wei He, Jhong-Yan Chang, Yen-Chen Chen
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Publication number: 20110315359Abstract: A radiator fan module has a fan assembly, cooling fin and heat conductor. The fan assembly has a shell seat and fan blade, an air outlet is set at one side of the shell seat, the cooling fin is set correspondingly to the outlet, and the cooling end of the conductor is mated with the fin. The outlet forms an inward extended wall, an outward extended wall and an extended inner space set between the outlet and fan blade. The outlet has a width-reducing pattern. A notched space is formed externally between the inward extended wall and shell seat. An inward extended heat conductor is formed by the extension of the inner end of the cooling fin and is located within the range of the extended inner space, and provided with a blade corresponding side that is located correspondingly to a peripheral position of the blade.Type: ApplicationFiled: May 27, 2011Publication date: December 29, 2011Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Ming-Cyuan SHIH, Sin-Wei He, Jhong-Yan Chang, Tzu-Hsin Huang
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Patent number: 8057071Abstract: The present invention provides an end-side heat extraction light emitting diode or LED lamp. The LED lamp includes a lamp housing, a cooling module, and an LED lighting set. The cooling module is configured inside the housing space of the lamp housing, having a cooling fan and a cooling base. The LED lighting set is configured on the LED joint surface of the cooling base. The end-side heat extraction LED lamp also includes a circular frame and an end-side heat extraction airflow guidance passage. The circular frame forms a space extending and expanding to the end side. The end-side heat extraction airflow guidance passage forms an airflow guidance space extending and expanding to the end side, forming a heat radiating path where the heat extraction airflow generated by the running cooling fan of the LED lamp can be exhausted from the light projection end of the lamp housing.Type: GrantFiled: December 31, 2008Date of Patent: November 15, 2011Assignee: Forcecon Technology Co., Ltd.Inventors: Sin-Wei He, Jhong-Yan Chang
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Publication number: 20100020537Abstract: The present invention provides an end-side heat extraction light emitting diode or LED lamp. The LED lamp includes a lamp housing, a cooling module, and an LED lighting set. The cooling module is configured inside the housing space of the lamp housing, having a cooling fan and a cooling base. The LED lighting set is configured on the LED joint surface of the cooling base. The end-side heat extraction LED lamp also includes a circular frame and an end-side heat extraction airflow guidance passage. The circular frame forms a space extending and expanding to the end side. The end-side heat extraction airflow guidance passage forms an airflow guidance space extending and expanding to the end side, forming a heat radiating path where the heat extraction airflow generated by the running cooling fan of the LED lamp can be exhausted from the light projection end of the lamp housing.Type: ApplicationFiled: December 31, 2008Publication date: January 28, 2010Applicant: FORCECON TECHNOLOGY Co., Ltd.Inventors: Sin-Wei HE, Jhong-Yan Chang
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Publication number: 20090071633Abstract: The heat pipe structure includes a pipe body, hollow groove and capillary tissue. The pipe body contains a heat-conducting end and a radiating end. The capillary tissue of a predefined thickness is adapted to an inner wall of the pipe body. The inner surface of capillary tissue is located correspondingly to the section of the heat-conducting end, where a portion with greater thickness is shaped from another section of the capillary tissue. The portion is of single side, a plurality of sides or annular structure. Thus, the heat conduction efficiency of the heat-conducting end greatly improves. The non heat-conducting sections of the capillary tissue remain still with respect to thickness, and the guide space expands to facilitate guiding of gaseous working fluid to the radiating end, thus achieving an optimum heat radiation effect.Type: ApplicationFiled: September 13, 2007Publication date: March 19, 2009Applicant: FORCECON TECHNOLOGY Co., Ltd.Inventors: Sin-Wei HE, Jhong-Yan Chang
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Publication number: 20080253080Abstract: The panel-type heat sink module combines the heat-conducting panel, fin heat sink, diversion tank, fan and heat pipe into a single module. There is a heat-conducting surface and an assembly surface of the heat-conducting panel. The fin heat sink is assembled onto the assembly surface. The diversion tank is adapted onto the assembly surface and located nearby the fin heat sink. The diversion tank includes a fan container and a diversion channel. The fan is assembled into the fan container, and the heat pipe is assembled between the assembly surface and the fin heat sink. The heat pipe penetrates through the diversion tank; thus, the heat sources guided by the heat-conducting panel will be uniformly guided into the fin heat sink and diversion tank via the heat pipe. An air stream generated by the fan flows towards the fin heat sink, improving heat-radiation, and reducing assembly space.Type: ApplicationFiled: May 4, 2007Publication date: October 16, 2008Applicant: FORCECON TECHNOLOGY Co., Ltd.Inventors: Sin-Wei HE, Jhong-Yan Chang
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Publication number: 20060191325Abstract: The heat conductor with a micro detection element and a testing method thereof. The method includes injecting the micro detection element into the heat conductor after completion of vacuum pumping for the heat conductor. The micro detection element generally refers to inert gases of lighter atomic weight, such as helium and argon, etc. Next, the heat conductor is sealed. Secondly, a detector is used to detect if there is any leakage of micro detection element from exterior of heat conductor. The invention makes possible speeding up the test process and quickly identifying the vacuum state of heat conductor for a higher availability.Type: ApplicationFiled: February 28, 2005Publication date: August 31, 2006Applicant: FORCECON TECHNOLOGY Co., Ltd.Inventors: Ming-Cyuan Shih, Sin-Wei He, Jhong-Yan Chang
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Publication number: 20060183374Abstract: The sealing method and construction of the sealing end for a heat conductor includes a heat conductor for vacuum pumping and sealing placed within an enclosed operating space, wherein an open end is preset for the heat conductor. Next, vacuum pumping is performed for entire enclosed operating space, thereby finishing the vacuum pumping procedure of heat pipe. Then, the open end of heat pipe is welded by fusing within enclosed operating space, wherein the sealing end of heat conductor forms a welded close end. A compression procedure can be neglected, thereby saving more manufacturing cost and offering a higher structural strength for the sealing part.Type: ApplicationFiled: February 14, 2005Publication date: August 17, 2006Applicant: FORCECON TECHNOLOGY Co., Ltd.Inventors: Ming-Cyuan Shih, Sin-Wei He, Jhong-Yan Chang