Patents by Inventor Jhy-Cherng Tsai

Jhy-Cherng Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for determining efficiently parameters in chemical-mechanical polishing (CMP)
    Patent number: 6564116
    Abstract: A method of determining efficiently parameters in chemical-mechanical polishing, especially a method includes a Neural-Taguchi method to seek the best parameter set to increase the quantity of output. This invention involves a time parameter to achieve end-point detection on line during the CMP procedure and also completes a maximum material removal rate (MRR) and a minimum within wafer non-uniformity (WIWNU) at the same time.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: May 13, 2003
    Inventors: Gou-Jen Wang, Jhy-Cherng Tsai, Jau-Liang Chen
  • Method for determining efficiently parameters in chemical-mechanical polishing (CMP)
    Publication number: 20030028279
    Abstract: A method of determining efficiently parameters in chemical-mechanical polishing, especially a method includes a Neural-Taguchi method to seek the best parameter set to increase the quantity of output. This invention involves a time parameter to achieve end-point detection on line during the CMP procedure and also completes a maximum material removal rate (MRR) and a minimum within wafer non-uniformity (WIWNU) at the same time.
    Type: Application
    Filed: April 6, 2001
    Publication date: February 6, 2003
    Inventors: Gou-Jen Wang, Jhy-Cherng Tsai, Jau-Liang Chen