Patents by Inventor JiAh MIN

JiAh MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film package and package module including the same
    Patent number: 10840191
    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Min Jung, JiAh Min
  • FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
    Publication number: 20200211973
    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 2, 2020
    Inventors: Jae-Min JUNG, JiAh MIN
  • Film package and package module including the same
    Patent number: 10643948
    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 5, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Min Jung, JiAh Min
  • FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
    Publication number: 20190363051
    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
    Type: Application
    Filed: January 7, 2019
    Publication date: November 28, 2019
    Inventors: Jae-Min JUNG, JiAh MIN