Patents by Inventor Ji Bum CHA

Ji Bum CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor module and method of manufacturing the same
    Patent number: 9287317
    Abstract: There is provided an image sensor module, including: an image sensor having a small thickness of 175 ?m or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: March 15, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Bum Cha, Sung Jae Lee, In Cheol Chang, Sung Jun Byun
  • IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140210027
    Abstract: There is provided an image sensor module, including: an image sensor having a small thickness of 175 ?m or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 31, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Bum CHA, Sung Jae LEE, In Cheol CHANG, Sung Jun BYUN