Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A folding pallet truck comprises a frame module, a lifting module installed on the frame module and comprising a mount, and a handle module comprising a tube in rotating fit with the mount, wherein a first constraint part is formed between an end, rotatably connected to the mount, of the tube and the mount, and the handle module is folded by detaching the first constraint part or is unfolded by reassembling the first constraint part. The handle module can be folded to be stored or be unfolded and locked to be used by detaching or reassembling the first constraint part formed between the tube of the handle module and the mount of the lifting module, operation is easy, and the pallet truck has a small size when stored.

Abstract: Aminopyridine and aminopyrazine compounds of formula (1), compositions including these compounds, and methods of their use are provided. Preferred compounds of formula 1 have activity as protein kinase inhibitors, including as inhibitors of c-MET.

Abstract: Aminopyridine and aminopyrazine compounds of formula (1), compositions including these compounds, and methods of their use are provided. Preferred compounds of formula 1 have activity as protein kinase inhibitors, including as inhibitors of c-MET.