Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cm?1 to 600 cm?1. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is ?(cm?1), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is ?+0.75 cm?1 or greater.

Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.

Abstract: The present invention provides an isotropic etching method of two-dimensional semiconductor materials. The present invention provides an isotropic etching method of two-dimensional semiconductor materials including a first operation of arranging an etching object having a two-dimensional transition metal chalcogenide layer inside an etching space of a remote plasma system in which a discharge space and the etching space are separated, a second operation of extracting oxygen or halogen radical among plasma generated in the discharge space and reacting the two-dimensional transition metal chalcogenide layer with a surface to form an oxide layer and a radical adsorbate layer, and a third operation of selectively removing the oxide layer and the radical adsorbate layer in the etching space, wherein only an upper layer of the two-dimensional transition metal chalcogenide is precisely etched in units of atoms without defects and damage in a lower layer.

Abstract: One embodiment of the present invention provides an atomic layer deposition device for filling a gap of a semiconductor structure with a high aspect ratio and a method of manufacturing the same. According to the atomic layer deposition method of filling the gap of the semiconductor structure with the high aspect ratio according to one embodiment of the present invention, it is possible to remove an overhang at an pattern top at the same time as deposition and perform the gap-filling to remove a void and a seam by improving bottom-up deposition in a high aspect ratio structure of 40:1 or more.

Abstract: Proposed is a system for monitoring internal conditions of a processing chamber. The system includes at least one sensor provided inside the processing chamber and configured to measure an amount of reactant present inside the processing chamber, and a monitoring apparatus configured to monitor the internal conditions of the processing chamber on the basis of a measurement value received from the at least one sensor, wherein the monitoring apparatus determines at least one of a start point and an end point of a cleaning process for the processing chamber on the basis of a change in the measurement value.

Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.

Abstract: The present invention introduces a plasma etching method and apparatus. The plasma etching method may include forming a photoresist pattern on a target etching layer, hardening the surface of the photoresist pattern by exposing to a first plasma generated from a first discharge gas containing a reforming gas including carbon (C) and sulfur (S) and sequentially annealing, and etching the target etching layer with a second plasma generated from a second discharge gas using the surface-hardened photoresist pattern as a mask.

Abstract: The present invention relates to a method for purification of hemopexin and haptoglobin and provides a method in which a solution containing hemopexin and haptoglobin is titrated to a range of specific pH values without a step of precipitating haptoglobin by salt addition, followed by separating and purifying hemopexin and haptoglobin individually.

Abstract: A battery module includes a printed circuit board (PCB) having a copper pattern; a flexible printed circuit board (FPCB) having a copper pattern; and a conductive bonding portion for bonding the PCB to the FPCB, wherein the copper pattern of the PCB and the copper pattern of the FPCB are electrically connected to each other by a conductive metal particles, and wherein at least one of the copper pattern of the PCB and the copper pattern of the FPCB has at least one or more alloy layers selected from a group consisting one or more of Ni—Sn and Au—Ni—Sn—Bi.

Abstract: A battery module and a battery pack including the same are disclosed. In some implementations, the battery module may include a plurality of battery cells; and a cell monitoring portion connected to the plurality of battery cells, the cell monitoring portion including a plurality of boards collecting information on at least one of temperature, current, and voltage of the plurality of battery cells. The plurality of boards may be separable.

Abstract: A battery module includes a battery cell stack in which a plurality of battery cells are stacked; a module case for accommodating the battery cell stack therein; and a bus bar assembly disposed between the module case and the battery cell stack and electrically connected to the battery cells. The bus bar assembly may include at least one bus bar and a thermal conduction unit for embedding the bus bar therein. The thermal conduction unit may be formed of a resin material containing a thermally conductive filler.

Abstract: A battery module includes at least one cell stack including a plurality of battery cells, a housing in which at least one accommodating space is formed, a busbar assembly including at least one busbar, and a busbar support member, and a sensing module assembly provided to measure the state of the battery cell. The sensing module assembly comprises a sensing circuit board having a circuit, a temperature sensor installed to be spaced apart from the sensing circuit board, a sensor connection member connecting the sensing circuit board and the temperature sensor and installed by penetrating through a sensor installation opening formed in the busbar support member, and a sensor fixing member installed by penetrating through the sensor installation opening such that the temperature sensor measures a temperature at a preset position.

Abstract: A battery module includes a plurality of battery cells stacked in one direction; and an end plate assembly covering an outermost battery cell disposed on the outermost among the plurality of battery cells, wherein the end plate assembly includes at least one thermistor for measuring a temperature of the outermost battery cell.

Abstract: A battery module includes a cell stack; a busbar assembly including at least one busbar electrically connected to the plurality of battery cells, and a busbar support member disposed between the at least one busbar and the cell stack; and a housing having a plurality of accommodation spaces partitioned by a partition member, wherein the cell stack includes a first stack disposed in a first accommodation space located on a first side of the partition member, and a second stack disposed in a second accommodation space located on a second side of the partition member; the busbar assembly includes a first assembly electrically connected to the first stack, and a second assembly electrically connected to the second stack; and the first assembly and the second assembly are electrically connected to at least one of both ends of the plurality of accommodation spaces.

Abstract: A battery module includes a cell stack in which a plurality of battery cells are stacked; and a housing having a plurality of accommodation spaces partitioned by a partition member, to accommodate a plurality of the cell stack, wherein the housing includes a first frame and a second frame, coupled to each other to form the plurality of accommodation spaces, wherein the first frame and the second frame include a coupling portion that is coupled in a fitting coupling manner, respectively.

Abstract: A battery pack includes a pack housing, and at least one battery assembly accommodated in the pack housing. The battery assembly includes a first cell stack and a second cell stack in each of which a plurality of battery cells are stacked, and a busbar assembly electrically connecting the plurality of battery cells to each other. The busbar assembly includes a first coupling portion coupled to the first cell stack, a second coupling portion coupled to the second cell stack, and a connection portion connecting the first coupling portion and the second coupling portion to each other.

Abstract: A battery pack includes a pack case accommodating a first battery module and a second battery module, and a busbar including a first body portion fastened to the first battery module, a second body portion fastened to the second battery module, and at least one breakable portion disposed between the first body portion and the second body portion and fused at a temperature lower than those of the first body portion and the second body portion. The busbar includes an insulating cover covering the first and second body portions and the breakable portion, and a flameproof cover covering the insulating cover. At least a portion of the insulating cover covering the breakable portion is exposed to the outside of the flameproof cover.

Abstract: A battery cell bundle comprises a support member including a barrier wall including first and second sides extending from an end of the support member; a plurality of first battery cells disposed on the first side of the barrier wall and a plurality of second battery cells disposed on the second side of the barrier wall; and an internal busbar to electrically connect the plurality of battery cells to each other, wherein the internal busbar includes a first busbar to electrically connect the plurality of first battery cells to each other, and a second busbar to electrically connect the plurality of second battery cells to each other, and wherein a portion of the first busbar is electrically connected to a portion of the second busbar.

Abstract: A battery cell bundle includes a support member including at least one barrier wall including first and second sides; a plurality of first battery cells disposed on the first side of the at least one barrier wall; a plurality of second battery cells disposed on the second side of the at least one barrier wall; a cover member surrounding at least a portion of an outer portion of the plurality of first and second battery cells, and coupled to the support member such that the cover member and the support member define an internal space; and a panel member covering ends of the internal space, wherein the internal space is divided into a plurality of installation spaces by the at least one barrier wall, and wherein the first and second battery cells are disposed in each of the installation spaces.

Abstract: A battery module includes: a plurality of battery cells which have positive electrode tabs and negative electrode tab formed at both ends thereof, respectively, wherein the plurality of battery cells are stacked; a first bus bar assembly having first bus bars to which the positive electrode tabs and the negative electrode tabs located at one end of the battery cells are connected; a second bus bar assembly having second bus bars to which the positive electrode tabs and the negative electrode tabs located at the other end of the battery cells are connected; and a sensing unit which is connected to any one bus bar of the first and second bus bars to detect states of the battery cells.