Patents by Inventor Ji Eun Son

Ji Eun Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110134161
    Abstract: A flexible printed circuit board (FPCB) capable of improving strength is disclosed, the FPCB comprising a base film; a copper layer on the base film, the copper layer including a circuit pattern, and a strength-reinforcing pattern in an area without the circuit pattern; and a coverlay film on the copper layer.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 9, 2011
    Inventors: Ji Eun Son, Kyung Sik Dan, Se Min Lee, Min Jin Lee