Patents by Inventor Ji-Eun WOO

Ji-Eun WOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12233113
    Abstract: Provided are a method for administering a recombinant human growth hormone GX-H9 for treating growth hormone deficiency and a pharmaceutical composition containing a recombinant human growth hormone GX-H9 and a pharmaceutically acceptable carrier. The method includes administering recombinant human growth hormone GX-H9 once a week with a dosage of 0.1 to 0.3 mg per weight kg of a patient or twice-monthly with a dosage of 0.1 to 0.4 mg per weight kg of the patient.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: February 25, 2025
    Assignees: GENEXINE, INC., HANDOK INC.
    Inventors: Tae Kyung Kim, Young Joo Ahn, Jung Won Woo, Ji-Eun Cha, Joan Yoon Ji Lee, Woo Ick Jang
  • Publication number: 20240115642
    Abstract: The present invention relates to a composition for preventing hair loss or promoting hair growth containing a milk thistle flower extract as an active ingredient. More specifically, the present invention relates to a cosmetic composition, pharmaceutical composition and food composition containing a milk thistle flower extract as an active ingredient, which are able to promote hair growth by inducing the proliferation of dermal papilla cells reduced due to senescence, and activate dermal papilla cells by inhibiting the senescence of dermal papilla cells through inhibition of the activity of senescence-associated ?-galactosidase (SA-?-Gal) and the production of senescence-associated secretory phenotypes, thereby preventing hair loss or promoting hair.
    Type: Application
    Filed: August 18, 2022
    Publication date: April 11, 2024
    Inventors: Ji Eun WOO, Seoung Woo SHIN, Eun Sun JUNG, Deok Hoon PARK
  • Patent number: 11127692
    Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gun Lee, Jun Gul Hwang, Ji Eun Woo, Sung Keun Park
  • Publication number: 20200168562
    Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.
    Type: Application
    Filed: April 24, 2019
    Publication date: May 28, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gun Lee, Jun Gul Hwang, Ji Eun Woo, Sung Keun Park
  • Patent number: 10626288
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye Shim, Ki-Seok Kim, Ji-Eun Woo
  • Publication number: 20190345326
    Abstract: A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.
    Type: Application
    Filed: April 24, 2019
    Publication date: November 14, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki-Seok KIM, Ji-eun WOO, Ji-Hye SHIM, Hyung-Mi JUNG
  • Publication number: 20160244605
    Abstract: A resin composition and a printed circuit board comprising the same, include an epoxy resin, and a teflon resin including nano-silica on a surface thereof.
    Type: Application
    Filed: February 22, 2016
    Publication date: August 25, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki-Seok KIM, Ji-Hye SHIM, Hyung-Mi JUNG, Ji-Eun WOO
  • Publication number: 20160208143
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Application
    Filed: November 23, 2015
    Publication date: July 21, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye SHIM, Ki-Seok KIM, Ji-Eun WOO