Patents by Inventor Ji-Eun WOO

Ji-Eun WOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board
    Patent number: 10626288
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye Shim, Ki-Seok Kim, Ji-Eun Woo
  • LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME
    Publication number: 20190345326
    Abstract: A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.
    Type: Application
    Filed: April 24, 2019
    Publication date: November 14, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki-Seok KIM, Ji-eun WOO, Ji-Hye SHIM, Hyung-Mi JUNG
  • RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING THE SAME
    Publication number: 20160244605
    Abstract: A resin composition and a printed circuit board comprising the same, include an epoxy resin, and a teflon resin including nano-silica on a surface thereof.
    Type: Application
    Filed: February 22, 2016
    Publication date: August 25, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki-Seok KIM, Ji-Hye SHIM, Hyung-Mi JUNG, Ji-Eun WOO
  • RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, RESIN VARNISH USING THE SAME, ADHESIVE FILM, PREPREG AND PRINTED WIRING BOARD
    Publication number: 20160208143
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Application
    Filed: November 23, 2015
    Publication date: July 21, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye SHIM, Ki-Seok KIM, Ji-Eun WOO