Abstract: Provided are a method for administering a recombinant human growth hormone GX-H9 for treating growth hormone deficiency and a pharmaceutical composition containing a recombinant human growth hormone GX-H9 and a pharmaceutically acceptable carrier. The method includes administering recombinant human growth hormone GX-H9 once a week with a dosage of 0.1 to 0.3 mg per weight kg of a patient or twice-monthly with a dosage of 0.1 to 0.4 mg per weight kg of the patient.

Abstract: The present invention relates to a composition for preventing hair loss or promoting hair growth containing a milk thistle flower extract as an active ingredient. More specifically, the present invention relates to a cosmetic composition, pharmaceutical composition and food composition containing a milk thistle flower extract as an active ingredient, which are able to promote hair growth by inducing the proliferation of dermal papilla cells reduced due to senescence, and activate dermal papilla cells by inhibiting the senescence of dermal papilla cells through inhibition of the activity of senescence-associated ?-galactosidase (SA-?-Gal) and the production of senescence-associated secretory phenotypes, thereby preventing hair loss or promoting hair.

Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.

Abstract: A low-loss insulating resin composition and an insulating film using the same are provided. The low-loss insulating resin composition comprises an epoxy resin composite including 40 to 60 parts by weight of a cyanate ester resin, 15 to 35 parts by weight of a biphenylaralkyl novolac resin, and 15 to 35 parts by weight of a fluorine-containing epoxy resin; a hardener; a thermoplastic resin; a hardening accelerator; an inorganic filler; a viscosity enhancer; and an additive.

Abstract: A resin composition and a printed circuit board comprising the same, include an epoxy resin, and a teflon resin including nano-silica on a surface thereof.

Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.