Patents by Inventor Ji-Eun Yun

Ji-Eun Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same
    Patent number: 11062940
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 13, 2021
    Assignees: Samsung Electronics Co., Ltd., DNF Co., Ltd.
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-yong Lee, Sang-Ick Lee, Sung-Woo Cho
  • Organometallic Precursors, Methods Of Forming A Layer Using The Same And Methods Of Manufacturing Semiconductor Devices Using The Same
    Publication number: 20190304835
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Chang-Woo Sun, Ji-Eun YUN, Jae-Soon LIM, Youn-Joung CHO, Myong-Woon KIM, Kang-yong LEE, Sang-Ick LEE, Sung-Woo CHO
  • Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same
    Patent number: 10361118
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: July 23, 2019
    Assignees: Samsung Electronics Co., Ltd., DNF Co. Ltd.
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-Yong Lee, Sang-Ick Lee, Sung-Woo Cho
  • ORGANOMETALLIC PRECURSORS, METHODS OF FORMING A LAYER USING THE SAME AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
    Publication number: 20180102284
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Application
    Filed: April 27, 2017
    Publication date: April 12, 2018
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-Yong Lee, Sang-Ick Lee, Sung-Woo Cho