Patents by Inventor Ji-Eun Yun

Ji-Eun Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230264963
    Abstract: A method for fabricating trihalodisilane, the method includes providing a halodisilane including at least four halogen atoms; reducing the halodisilane, using a mixed reducing agent including a first reducing agent represented by following Chemical Formula 1-1, in which RA is an alkyl group, and m and n are each independently 1 or 2, and m+n=3, and a second reducing agent represented by following Chemical Formula 2-1, in which RS is an alkyl group or an aryl group, p and q are each independently 1, 2, or 3, and p+q=4; and obtaining a product including a 1,1,1-trihalodisilane, (RA)m—Al—Hn??[Chemical Formula 1-1] (RS)p—Sn—Hq.
    Type: Application
    Filed: January 24, 2023
    Publication date: August 24, 2023
    Applicant: WONIK Materials Co., Ltd.
    Inventors: Ji Eun YUN, Byung Keun HWANG, Min Soo KANG, Sheby Mary GEORGE, Woo Ri BAE, Sun Hye HWANG, Seong Tae OH, Byeong Ok CHO
  • Patent number: 11062940
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 13, 2021
    Assignees: Samsung Electronics Co., Ltd., DNF Co., Ltd.
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-yong Lee, Sang-Ick Lee, Sung-Woo Cho
  • Publication number: 20190304835
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Chang-Woo Sun, Ji-Eun YUN, Jae-Soon LIM, Youn-Joung CHO, Myong-Woon KIM, Kang-yong LEE, Sang-Ick LEE, Sung-Woo CHO
  • Patent number: 10361118
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: July 23, 2019
    Assignees: Samsung Electronics Co., Ltd., DNF Co. Ltd.
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-Yong Lee, Sang-Ick Lee, Sung-Woo Cho
  • Publication number: 20180102284
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Application
    Filed: April 27, 2017
    Publication date: April 12, 2018
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-Yong Lee, Sang-Ick Lee, Sung-Woo Cho