Abstract: The present invention relates to a composition for preventing, alleviating or treating sarcopenia, containing D-ribo-2-hexulose as an active ingredient. D-ribo-2-hexulose of the present invention is a sweetener capable of replacing sugar, is harmless to the human body and does not cause side effects in normal cells so as to be safe for the human body, inhibits the degradation of myoproteins, and can exhibit muscle strengthening effects by increasing muscle mass, and thus the present invention is expected to be effectively usable in the prevention, alleviation or treatment of sarcopenia.

Abstract: A semiconductor device includes a substrate, a first sheet pattern on the substrate, a gate electrode on the substrate and surrounding the first sheet pattern, a first source/drain pattern and a second source/drain pattern respectively connected to a first end and a second end of the first sheet pattern, a contact blocking pattern on a lower side of the second source/drain pattern, a first source/drain contact extending in a first direction and connected to the first source/drain pattern, and a second source/drain contact connected to the second source/drain pattern and extending in the first direction to contact an upper surface of the contact blocking pattern. A depth from an upper surface of the gate electrode to a lowermost portion of the first source/drain contact may be greater than a depth from the upper surface of the gate electrode to the upper surface of the contact blocking pattern.

Abstract: The copper organic metal is constituted to combine a copper atom, [R—CO2] and amine based ligand (L), thereby making it possible to be subjected to a low temperature sintering process and having an improved conductivity at the time of forming a conductive pattern.

Abstract: Disclosed herein are a copper organic metal, a method for preparing a copper organic metal and a copper paste. The copper organic metal is constituted to combine a copper atom, [R—CO2] and amine based ligand (L), thereby making it possible to be subjected to a low temperature sintering process and having an improved conductivity at the time of forming a conductive pattern as compared to the related art.

Abstract: There is provided a method of producing a copper precursor and a copper precursor produced by using the same. The method of producing a copper precursor includes: preparing an aqueous solution including a copper salt or a hydrate thereof; preparing a mixture by mixing urea (CO(NH2)2) with the aqueous solution; and synthesizing the copper precursor by heating the mixture at a temperature of 100 to 120° C.

Abstract: There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit.

Abstract: An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and a temperature control unit having a heat exchange passage in at least one of the flow path plate and the nozzle plate in order to control temperature of the ink.

Abstract: Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200° C. or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on.

Abstract: There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file.

Abstract: Disclosed herein is an inkjet printer head assembly. The inkjet printer head assembly according to exemplary embodiments of the present invention includes: a storage unit having an inner space in which a solution is stored; a fluid supplier supplying fluid to the storage unit; and an agitator provided in the storage unit and driven by the fluid supplied to the storage unit from the fluid supplier to agitate the solution.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.

Abstract: There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit.

Abstract: An inkjet head and an inkjet printer having the inkjet head are disclosed. In accordance with an embodiment of the present invention, the inkjet head includes a chamber housing ink and a nozzle, which discharges the ink housed in the chamber. Here, a plurality of inner wall grooves are formed on an inner wall of the nozzle, in which the plurality of inner wall grooves extends in a lengthwise direction of the nozzle. Thus, the inkjet head can discharge big ink droplets at a high frequency by quickly filling the ink in the nozzle after relatively big ink is discharged.

Abstract: An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and a temperature control unit having a heat exchange passage in at least one of the flow path plate and the nozzle plate in order to control temperature of the ink.