Patents by Inventor Ji Hee Kim

Ji Hee Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090014439
    Abstract: Disclosed is a non-contact high-frequency induction heating apparatus for plastic mold and injection nozzle thereof in that only a partial area of a cavity and a runner area of an injection nozzle are rapidly heated by means of a non-contact high-frequency induction heating manner during the injection of a melting resin of high temperature, so that it can minimize a temperature variation between the cavity and runner and the melting resin of high temperature in order to smoothly supply the melting resin to the cavity and injection nozzle, whereby preventing various outward inferiorities of the molding product and improving the efficiency of the melting resin injection apparatus.
    Type: Application
    Filed: March 2, 2007
    Publication date: January 15, 2009
    Inventor: Ji-Hee Kim
  • Patent number: D553652
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: October 23, 2007
    Assignee: LG Electronics Inc.
    Inventors: Kyung Soo Park, Ji Hee Kim
  • Patent number: D584293
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: January 6, 2009
    Assignee: LG Electronics Inc.
    Inventors: Ji Hee Kim, Hyo Gon Kim, Yun Jin Park
  • Patent number: D585430
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: January 27, 2009
    Assignee: LG Electronics Inc.
    Inventors: Ji Hee Kim, Hyo Gon Kim, Yun Jin Park