Patents by Inventor Ji Ho Hong
Ji Ho Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12179380Abstract: A press apparatus for vehicle crash pads including real wood sheets. The press apparatus includes a lower press including an engraved part, and a support part to support an upper press, the support part having a fixing protrusion, the upper press including an embossed part, first slides fixed to maintain a shape of the engraved part during a compression process of the real wood sheet, the first slides compressing a rear surface of the real wood sheet while rising along the embossed part, and a second slide to compress the real wood sheet during the compression process of the real wood sheet. During a wrapping process of the real wood sheet, the second slide compresses the real wood sheet to an inner rear surface of a core while falling such that a portion of the real wood sheet bent inward of the engraved part is wound around the core.Type: GrantFiled: June 15, 2022Date of Patent: December 31, 2024Assignees: Hyundai Mobis Co., Ltd., Seoyon Autovision Co., Ltd.Inventors: Ik Keun Choi, Min Kyeong Lee, Hyun Ho Lee, Ji Seung Hong, Jong Jin Lee
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Publication number: 20240367391Abstract: The present disclosure relates to a stitched electromagnetic wave-absorbing composite for low-speed impact protection, and particularly, to a composite that exhibits electromagnetic wave absorption performance and low-speed impact protection performance at the same time by applying a stitching method, a thickness direction reinforcement method, to a composite that is an electromagnetic wave absorber. The present disclosure provides a stitched electromagnetic wave-absorbing composite for low-speed impact protection including a composite composed of at least one of glass fiber, epoxy, or glass fiber reinforced plastics (GFRP) in an electromagnetic wave-absorbing composite, wherein the composite absorbs electromagnetic waves, and has an impact protection system applied thereto through stitching.Type: ApplicationFiled: November 18, 2021Publication date: November 7, 2024Applicant: Industry-Academic Cooperation Foundation Gyeongsang National UniversityInventors: Young Woo Nam, Jin Ho CHOI, Byeong Su KWAK, Uy Hwa SEO, Woo Jin AN, Ji Sub NOH, Dong Jun HONG
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ACCESS CARD PROVIDING METHOD, ACCESS CARD CHECKING METHOD, AND APPARATUS FOR PERFORMING SAME METHODS
Publication number: 20240242551Abstract: An access card providing method, an access card checking method, and an apparatus for performing the methods are disclosed. An access card providing method may comprise producing a virtual access card by a partner terminal desiring to produce the access card, which allows entering of an online or offline area of a partner, wherein the access card is provided through an application of a user terminal. An access card checking method may comprise, when a user terminal having issued an access card to an offline area of a partner recognizes identification information, identifying whether an access card corresponding to the identification information has been issued so as to check the access card.Type: ApplicationFiled: May 17, 2022Publication date: July 18, 2024Inventors: Hyeon Su JEON, Jae Ho KIM, Jeong Ho KIM, Seung Hyun KO, Geun Tak HAN, Na Yeong HONG, Seung Yeop YEOM, Ji Hyun KIM -
Publication number: 20240238380Abstract: The present invention relates to a pharmaceutical composition for the prevention or treatment of diabetes, obesity, dyslipidemia, or metabolic syndrome by administering in combination with a GLP-1 (glucagon-like peptide-1) receptor agonist, comprising a GDF15 (growth differentiation factor-15) variant, a long-acting GDF15 fusion protein, or a long-acting GDF15 fusion protein dimer as an active ingredient.Type: ApplicationFiled: May 20, 2022Publication date: July 18, 2024Inventors: Seyoung LIM, Ji Eun YANG, Sukyung KIM, Bo Ra SIM, Yunji LEE, Do Hoon KIM, Mi Kyeong JU, Hyun Ho CHOI, Han Na HONG, Junhwan KIM
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Publication number: 20240026511Abstract: Provided is a galvannealed steel sheet having excellent powdering resistance, and a manufacturing method therefor. The galvannealed steel sheet includes: base iron; and an alloying hot-dip galvanized layer provided on the surface thereof. The base iron includes, by weight %; 0.003 to 0.009% of carbon (C); 0.05% or less of silicon (Si); 0.4 to 1.0% of manganese (Mn); 0.04 to 0.09% of phosphorus (P); 0.01% or less of sulfur (S); 0.005% or less of nitrogen (N); 0.1% or less of aluminum (S.Al); 0.05 to 0.08% of molybdenum (Mo); 0.005 to 0.03% of titanium (Ti); 0.02 to 0.045% of niobium (Nb); 0.06 to 0.1% of copper (Cu); 0.0015% or less of boron (B), and a balance of Fe and inevitable impurities. An average thickness of a gamma (?) phase present at an interface between the base iron and the alloying hot-dip galvanized layer is 0.20 ?m or less.Type: ApplicationFiled: December 9, 2021Publication date: January 25, 2024Inventors: Yu-Mi HA, Jun-Sung YEOM, Ji-Ho HONG
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Patent number: 11655951Abstract: Provided is a lamp for a vehicle to prevent light efficiency from being deteriorated while being embodied in a slim form factor. The lamp for a vehicle includes a light emission portion to generate light; a first optical portion disposed in front of the light emission portion to allow the light generated from the light emission portion to be incident thereto; and a second optical portion disposed between the light emission portion and the first optical portion. The second optical portion refracts the light in a direction different from a light refracting direction of the first optical portion.Type: GrantFiled: September 17, 2021Date of Patent: May 23, 2023Assignee: SL CorporationInventors: Kyung Su Lee, Woo Yeong Son, Ji Ho Hong
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Publication number: 20230133672Abstract: Disclosed are: a fusion polypeptide comprising growth differentiation factor 15 (GDF15) and a polypeptide region capable of O-glycosylation; a pharmaceutical composition comprising the fusion polypeptide; and a method for increasing the in vivo duration of GDF15, comprising the step of fusing a polypeptide region capable of O-glycosylation.Type: ApplicationFiled: December 10, 2020Publication date: May 4, 2023Applicant: LG CHEM, LTD.Inventors: Yeonchul KIM, Young Dok SON, Kyubong NA, Ji Ho HONG, Saem JUNG, Myung Won JIN, Ji A PARK, Soomin NOH, Hyuntaek PARK
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Publication number: 20230053119Abstract: Provided is a fusion polypeptide comprising GDF15 (Growth/differentiation factor 15) and an Fc region of immunoglobulin, a pharmaceutical composition comprising the fusion polypeptide, and a method of increasing in vivo duration of GDF15 comprising fusing with an Fc region of immunoglobulin.Type: ApplicationFiled: April 22, 2020Publication date: February 16, 2023Applicant: LG CHEM, LTD.Inventors: Yeonchul KIM, Kyeongsik MIN, Young Dok SON, Kyubong NA, Ji Ho HONG, Saem JUNG, Myung Won JIN, Ji A PARK, Soomin NOH
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Publication number: 20220289731Abstract: The present invention relates to a compound exhibiting excellent agonist activity against melanocortin receptors. More specifically, the present invention relates to a compound of Formula 1, a pharmaceutical composition comprising the compound as an active ingredient, and a use thereof, and the compound of the present invention exhibits excellent agonist activity against melacortin-4 receptors and can be particularly useful in preventing or treating obesity, diabetes, inflammation and erectile dysfunction.Type: ApplicationFiled: November 6, 2020Publication date: September 15, 2022Applicant: LG CHEM, LTD.Inventors: Seung Wan KANG, Hee Dong PARK, Hee Dong PARK, Su Jin YEO, Hyun Seo PARK, Ji Ho HONG, Hye Won AHN, Eun Sil CHOI
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Publication number: 20220099265Abstract: Provided is a lamp for a vehicle to prevent light efficiency from being deteriorated while being embodied in a slim form factor. The lamp for a vehicle includes a light emission portion to generate light; a first optical portion disposed in front of the light emission portion to allow the light generated from the light emission portion to be incident thereto; and a second optical portion disposed between the light emission portion and the first optical portion. The second optical portion refracts the light in a direction different from a light refracting direction of the first optical portion.Type: ApplicationFiled: September 17, 2021Publication date: March 31, 2022Inventors: Kyung Su Lee, Woo Yeong Son, Ji Ho Hong
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Patent number: 8097505Abstract: A method of forming an isolation layer in a semiconductor device is disclosed, by which breakdown voltage and PN junction leakage characteristics of the isolation layer are enhanced. Embodiments include depositing a pad nitride layer over a semiconductor substrate, reducing the thickness of the pad nitride layer by etching a portion of the pad nitride layer, forming a tetraethyl orthosilicate (TEOS) oxide layer over the remaining pad nitride layer, forming a trench by selectively removing the tetraethyl orthosilicate oxide layer and the pad nitride layer over an isolation area of the semiconductor substrate, depositing an high density plasma oxide layer over the substrate to fill the trench, and forming an isolation layer by planarizing the high density plasma oxide layer and the tetraethyl orthosilicate oxide layer.Type: GrantFiled: August 24, 2008Date of Patent: January 17, 2012Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 8049265Abstract: Provided are semiconductor devices and methods of fabricating the same. The semiconductor device comprises: a floating gate pattern formed in a cell area of a semiconductor substrate; a dummy floating gate pattern extending from the floating gate pattern into an interface area around the cell area; and a control gate pattern intersecting the floating gate pattern at the cell area of the semiconductor substrate.Type: GrantFiled: November 28, 2008Date of Patent: November 1, 2011Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji Ho Hong
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Patent number: 7968366Abstract: An image sensor and method of manufacturing the same are provided. According to an embodiment, the image sensor comprises: a circuit including an interconnection on a substrate; a lower electrode on the interconnection; a separated intrinsic layer on the lower electrode; a second conductive type conduction layer on the separated intrinsic layer; and an upper electrode on the second conductive type conduction layer. The separated intrinsic layer can have an inwardly sloping sidewall to focus light incident the photodiode for the unit pixel.Type: GrantFiled: March 17, 2008Date of Patent: June 28, 2011Assignee: Dongbu Hitek Co., Ltd.Inventor: Ji Ho Hong
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Patent number: 7888673Abstract: Provided is a monitoring pattern for a silicide that may include a plurality of poly pads, a plurality of N-well regions and P-well regions, active regions, and a poly gate line. The plurality of poly pads are disposed on a semiconductor substrate. The plurality of N-well regions and P-well regions are disposed in a single line between the poly pads. The active regions are disposed on the N-well and the P-well regions. The poly gate line electrically connects the active regions to the poly pads and has a configuration permitting it to pass through the active regions a plurality of times.Type: GrantFiled: June 13, 2008Date of Patent: February 15, 2011Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 7883950Abstract: Disclosed is a method of manufacturing a semiconductor device. The method comprises consecutively depositing and patterning polysilicon and mask material on a substrate to form a polysilicon layer and a mask layer, reducing a width of the polysilicon layer, depositing and etching insulating material on the substrate to form a spacer on a lateral side of the polysilicon layer, and forming a source/drain region in the substrate at sides of the spacer.Type: GrantFiled: October 19, 2007Date of Patent: February 8, 2011Assignee: Dongbu Hitek Co., Ltd.Inventor: Ji Ho Hong
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Patent number: 7851235Abstract: A test element group for monitoring leakage current in a semiconductor device and a method of manufacturing the same are disclosed. The test element group for monitoring leakage current in a semiconductor device includes device isolation layers formed over a first conductivity type semiconductor substrate. A second conductivity type well may be formed over the first conductivity type semiconductor substrate. First conductivity type impurity regions may be formed in first active areas between the device isolation layers in the second conductivity type well. Monitoring contacts may be formed within the first active areas to monitor leakage current, using layout data such that a distance from each of the monitoring contacts to a border of each of the first active areas is set to have an allowable minimum value under a predetermined design rule.Type: GrantFiled: July 12, 2008Date of Patent: December 14, 2010Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 7800107Abstract: A test module for measuring electrical characteristics of a semiconductor device includes a plurality of shallow trench isolation (STI) layers formed over a semiconductor substrate. An active area includes not only an extended part enclosing the STI layers but also a plurality of minute line-width parts isolated by the STI layers. A gate oxide layer is formed over the STI layers and the active area. A gate electrode is formed over the STI layers and the minute line-width parts of the active area with interposing the gate oxide layer. An interlayer insulating layer, a metal wiring layer, a contact plug, and test pads allow non-destructive testing of the semiconductor device.Type: GrantFiled: July 27, 2007Date of Patent: September 21, 2010Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 7790609Abstract: A method of forming a metal line in a semiconductor device is disclosed. The method of forming a metal line in a semiconductor device includes forming an interlayer insulating film over a substrate. A via hole may be formed by selectively patterning the interlayer insulating film. A metal film may be formed over a surface of the interlayer insulating film including an inner portion of the via hole. The inner portion of the via hole may be filled with copper. A copper layer exposed over the surface of the interlayer insulating film may be deplated using reverse current to form a copper metal line and a recess region over the copper metal line. An upper insulating film may be formed over the surface of the interlayer insulating film including the recess region by deposition. An insulating cap layer may be selectively formed over only the recess region on the copper metal line by etching the upper insulating film.Type: GrantFiled: September 5, 2007Date of Patent: September 7, 2010Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 7723795Abstract: A semiconductor memory device includes a first active region formed having a first portion extending laterally and second portion extendedly vertically upward from a central portion of the first portion; a second active region formed spaced from the first active region, the second active region having a third portion extending laterally, fourth and fifth portions extending vertically downwardly at distal end portions of the third portion, and a sixth portion extending vertically downwardly at a central portion of the third portion; a first gate formed extending vertically and overlapping the first portion of the first active region and the third portion of the second active regions; a second gate formed extending vertically and overlapping the first portion of the first active region and the third portion of the second active regions; a third gate formed extending in a direction perpendicular to the first and second gates and overlapping of the fourth and fifth portions of the second active region; and a plurType: GrantFiled: September 22, 2008Date of Patent: May 25, 2010Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong
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Patent number: 7683409Abstract: An image sensor including a second line formed at an upper part of a photodiode region as a transparent electrode for passing light. The second line is composed of a polymeric material having transparency and conductivity.Type: GrantFiled: April 20, 2008Date of Patent: March 23, 2010Assignee: Dongbu HiTek Co., Ltd.Inventor: Ji-Ho Hong