Patents by Inventor Ji-Ho LEE

Ji-Ho LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230347711
    Abstract: A vehicle air conditioning device includes an air conditioning case having a plurality of air discharge ports, a cooling heat exchanger and a heating heat exchanger sequentially formed in an air flow path of the air conditioning case, wherein the air discharge ports each have a face vent composed of the center vent and the side vents, a left-right temperature difference reduction means for reducing the temperature difference between a discharge port of the center vent and discharge ports of the side vents by reducing, in a first air conditioning mode, the cross-sectional area of the flow path through which air is discharged to the center vent, and by reducing, in a second air conditioning mode, the cross-sectional area of the flow path through which air is discharged to the side vents.
    Type: Application
    Filed: January 15, 2021
    Publication date: November 2, 2023
    Inventors: Tae Yeong PARK, Chan Joo MAENG, Ji Ho LEE
  • Publication number: 20230272242
    Abstract: A CMP slurry composition for polishing copper and a copper film polishing method using the same, the CMP slurry composition includes a solvent; an abrasive agent; and a compound including a structural unit represented by Formula 1 or a compound including a structural unit represented by Formula 2,
    Type: Application
    Filed: November 9, 2022
    Publication date: August 31, 2023
    Inventors: Soo Yeon SIM, Ji Ho LEE, Yong Goog KIM, Se Young CHOI, Ja Young HWANG, Jeong Hee KIM
  • Publication number: 20230220241
    Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition includes a solvent; an abrasive agent containing silica modified with a silane compound having at least one nitrogen atom; and an alkylene oxide group-containing fluorine surfactant.
    Type: Application
    Filed: November 7, 2022
    Publication date: July 13, 2023
    Inventors: Tae Won PARK, Jin Gyo KIM, Ji Ho LEE, Eui Rang LEE, Dong Hyeon LEE
  • Publication number: 20230173055
    Abstract: The present invention relates to an influenza virus surface protein-derived recombinant hemagglutinin (HA) protein forming a trimer and use thereof, and more specifically to a recombinant vector for producing an influenza virus surface protein-derived HA protein forming a trimer, a transformant transformed by the recombinant vector, a method for producing an influenza virus surface protein-derived HA protein forming a trimer using the recombinant vector, an influenza virus surface protein-derived HA protein produced by the method, and the use thereof in preventing, ameliorating or treating influenza virus-infected disease.
    Type: Application
    Filed: April 22, 2021
    Publication date: June 8, 2023
    Applicants: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION, BIOAPPLICATIONS INC, INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY, KONKUK UNIVERSITY INDUSTRIAL COOPERATION CORP
    Inventors: In Hwan HWANG, Jun Ho LEE, Diao HAIPING, Shijian SONG, Woe Yeon KIM, Min Gab KIM, Gyeong Ryul RYU, Gyeong Im SHIN, Chang Seon SONG, Ji Ho LEE, Deok Hwan KIM
  • Publication number: 20230108531
    Abstract: A CMP slurry composition for patterned tungsten wafers and a method of polishing patterned tungsten wafers using the same, the CMP slurry composition includes a solvent; an abrasive; and a non-dendrimeric poly(amidoamine).
    Type: Application
    Filed: August 19, 2022
    Publication date: April 6, 2023
    Inventors: Ji Ho LEE, Young Gi LEE, Soo Yeon SIM, Hyun Woo LEE, Jong Won LEE
  • Publication number: 20220298381
    Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer using the same. The CMP composition includes: a solvent; an abrasive agent; and a dendritic poly(amidoamine) containing a terminal amino group.
    Type: Application
    Filed: March 15, 2022
    Publication date: September 22, 2022
    Inventors: Soo Yeon SIM, Ji Ho LEE, Hyun Woo LEE, Jong Won LEE
  • Publication number: 20220298382
    Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition comprising a solvent; an abrasive agent; and a dendritic poly(amidoamine) containing a terminal functional group that has a pKa of about 6 or less.
    Type: Application
    Filed: March 15, 2022
    Publication date: September 22, 2022
    Inventors: Ji Ho LEE, Young Gi LEE, Soo Yeon SIM, Hyun Woo LEE, Chang Suk LEE, Jong Won LEE
  • Publication number: 20220232083
    Abstract: Provided are an IoT device and an IoT communication method. The IoT device may: be connected to a server via NAT; execute a first session for service connection; and execute a second session for calculating a particular keep-alive value corresponding to a period in which an IP address mapped by the NAT expires. The present invention can minimize transmission of a keep-alive value of an IoT device, enables an IoT device to share a particular keep-alive value with other IoT devices, and thus can minimize a network load which may be caused by a keep-alive value of an IoT communication device.
    Type: Application
    Filed: November 20, 2019
    Publication date: July 21, 2022
    Inventors: Seong Yun KIM, Seung Myeong JEONG, Ji Ho LEE
  • Publication number: 20220181792
    Abstract: Provided is an in-band full-duplex MIMO antenna, which includes: a substrate; and transmission antenna elements and reception antenna elements separately coaxially disposed on the same plane of the substrate, in which the transmission antenna elements have a first polarization characteristic, and the reception antenna elements have a second polarization characteristic different from the first polarization characteristic.
    Type: Application
    Filed: August 19, 2021
    Publication date: June 9, 2022
    Inventors: Han Lim LEE, Min Gyu KIM, Ji Ho LEE, Jin Woo KIM
  • Patent number: 10556224
    Abstract: This invention relates to a composite composition for harmful gas removal containing a copper-manganese catalyst, which is capable of removing ambient and indoor pollutants, such as carbon monoxide and volatile organic compounds, the composite composition including a copper-manganese composite catalyst hybridized with an inorganic layer compound, an inorganic filler, activated carbon, and a binder.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: February 11, 2020
    Assignee: SEILFA CO., LTD.
    Inventors: Yang Su Han, Ji Ho Lee, Sae Hee Kim, Hee Suk Lee
  • Patent number: 10522682
    Abstract: A semiconductor device is provided. The semiconductor device includes a fin type pattern, a field insulating film on a part of a sidewall of the fin-type pattern, and a gate electrode intersecting with the fin-type pattern, on the fin-type pattern and the field insulating film. The gate electrode on the field insulating film includes a first portion, a second portion, and a third portion on the field insulating film. A first width of the first portion increases as a first distance from the field insulating film, increases width of the second portion decreases as a second distance from the field insulating film increases, and a third width of the third portion increases or is substantially constant as a third distance from the field insulating film increases.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: December 31, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang Seop Yoon, Byung Ha Choi, Dae Geun Kim, Su Min Kim, Se Wan Park, Ji Ho Lee
  • Patent number: 10484780
    Abstract: Systems, methods, and audio output devices are described. In one aspect, an audio output device includes a communication module that communicates with an external electronic device, a speaker that outputs sound, a mounting detection sensor that detects whether the audio output device is mounted on a user of the audio output device, and a control circuit that is electrically connected with the communication module, the speaker, and the mounting detection sensor. The control circuit wirelessly connects the external electronic device with the audio output device using the communication module if the mounting of the audio output device is detected by the mounting detection sensor, receives audio data from the external electronic device through the wireless connection, and outputs the audio data using the speaker.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: November 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Woo Han, Ji Ho Lee, Hyun Jung Lee
  • Publication number: 20190246196
    Abstract: Systems, methods, and audio output devices are described. In one aspect, an audio output device includes a communication module that communicates with an external electronic device, a speaker that outputs sound, a mounting detection sensor that detects whether the audio output device is mounted on a user of the audio output device, and a control circuit that is electrically connected with the communication module, the speaker, and the mounting detection sensor. The control circuit wirelessly connects the external electronic device with the audio output device using the communication module if the mounting of the audio output device is detected by the mounting detection sensor, receives audio data from the external electronic device through the wireless connection, and outputs the audio data using the speaker.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 8, 2019
    Inventors: Sang Woo HAN, Ji Ho Lee, Hyun Jung Lee
  • Patent number: 10373750
    Abstract: The present invention relates to an apparatus of generating momentum which drives an object. The present invention provides a momentum generating apparatus in which a pair of high temperature superconducting coils which are wound in different directions and have different superconducting properties are arranged in parallel and the same current flows in the pair of coils to be in a stable state where magnetic fields generated in the coils are cancelled and an asymmetric current is suddenly applied to the pair of coils through a switching operation to generate a magnetic field and an eddy current is induced in a plate due to the generated magnetic field and the plate is floated using a repulsive force between the magnetic field generated in the plate due to the eddy current and the magnetic field generated in the pair of coils, to instantaneously generate force using a small amount of superconducting coils.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: August 6, 2019
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Tae Kuk Ko, Ji Ho Lee, Woo Seung Lee, Hyung Jun Kim, Seok Ho Nam, Young Gun Park, Jin Sub Kim
  • Patent number: 10313776
    Abstract: Systems, methods, and audio output devices are described. In one aspect, an audio output device includes a communication module that communicates with an external electronic device, a speaker that outputs sound, a mounting detection sensor that detects whether the audio output device is mounted on a user of the audio output device, and a control circuit that is electrically connected with the communication module, the speaker, and the mounting detection sensor. The control circuit wirelessly connects the external electronic device with the audio output device using the communication module if the mounting of the audio output device is detected by the mounting detection sensor, receives audio data from the external electronic device through the wireless connection, and outputs the audio data using the speaker.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: June 4, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang Woo Han, Ji Ho Lee, Hyun Jung Lee
  • Publication number: 20190043981
    Abstract: A semiconductor device is provided. The semiconductor device includes a fin type pattern, a field insulating film on a part of a sidewall of the fin-type pattern, and a gate electrode intersecting with the fin-type pattern, on the fin-type pattern and the field insulating film. The gate electrode on the field insulating film includes a first portion, a second portion, and a third portion on the field insulating film. A first width of the first portion increases as a first distance from the field insulating film, increases width of the second portion decreases as a second distance from the field insulating film increases, and a third width of the third portion increases or is substantially constant as a third distance from the field insulating film increases.
    Type: Application
    Filed: January 12, 2018
    Publication date: February 7, 2019
    Inventors: Chang Seop Yoon, Byung Ha Choi, Dae Geun Kim, Su Min Kim, Se Wan Park, Ji Ho Lee
  • Publication number: 20180345254
    Abstract: This invention relates to a composite composition for harmful gas removal containing a copper-manganese catalyst, which is capable of removing ambient and indoor pollutants, such as carbon monoxide and volatile organic compounds, the composite composition including a copper-manganese composite catalyst hybridized with an inorganic layer compound, an inorganic filler, activated carbon, and a binder.
    Type: Application
    Filed: March 17, 2016
    Publication date: December 6, 2018
    Applicant: SEILFA CO., LTD.
    Inventors: Yang Su HAN, Ji Ho LEE, Sae Hee KIM, Hee Suk LEE
  • Patent number: 10049792
    Abstract: Provided is a current lead wire using a superconducting tape. The current lead wire may comprise a first superconducting tape that electrically connects the first terminal and the second terminal; a second superconducting tape that is arranged in parallel with the first superconducting tape to electrically connect the first terminal with the second terminal; and a third superconducting tape that electrically connects the first superconducting tapes with the second superconducting tape.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: August 14, 2018
    Assignee: Industry-Academic Cooperation of Yonsei University
    Inventors: Tae Kuk Ko, Woo Seung Lee, Hyun Chul Jo, Young Jin Hwang, Ji Ho Lee, Seok Ho Nam
  • Patent number: 9948784
    Abstract: An electronic device and method are disclosed, including a first communication module configured to perform a cellular communication, a second communication module configured to perform a communication to connect the electronic device to an external electronic device, and at least one processor electrically connected to the first and second communication modules, executing the method, which includes activating the first communication module in response to detecting a preset condition, and transmitting a signal requesting call forwarding via the first communication module.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 17, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Ju Yu, Sung Sik Yoo, Yoo Kyung Koh, Yun Jeong Ko, Seul A Kim, Myung Hwan Lee, Ji Ho Lee
  • Patent number: D976878
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: January 31, 2023
    Assignee: Tescom Company Limited
    Inventors: Hee Suk Kim, Ji Ho Lee