Patents by Inventor Ji Ho Uh
Ji Ho Uh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11098406Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.Type: GrantFiled: July 24, 2018Date of Patent: August 24, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Il Jun Jeon, Ji Ho Uh, Je Hak Lee, Jun Sung Lee, Ji Woon Im
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Patent number: 11021796Abstract: A gas injector includes first and second gas introduction passages extending in a first direction toward a central axis of a process chamber respectively, a first bypass passage extending from the first gas introduction passage in a second direction that is substantially perpendicular to the first direction, a second bypass passage extending from the second gas introduction passage in a reverse direction to the second direction, a first distribution passage isolated from the first bypass passage in the first direction and extending from an outlet of the first bypass passage in the reverse direction to the second direction, a second distribution passage isolated from the second bypass passage in the first direction and extending from an outlet of the second bypass passage in the second direction, and a plurality of spray holes in an outer surface of the first and second distribution passages and configured to spray the process gas.Type: GrantFiled: December 6, 2018Date of Patent: June 1, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-Hyun Lee, Young-Kwon Kim, Woo-Jae Kim, Seung-Min Ryu, Ji-Ho Uh
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Publication number: 20190330741Abstract: A gas injector includes first and second gas introduction passages extending in a first direction toward a central axis of a process chamber respectively, a first bypass passage extending from the first gas introduction passage in a second direction that is substantially perpendicular to the first direction, a second bypass passage extending from the second gas introduction passage in a reverse direction to the second direction, a first distribution passage isolated from the first bypass passage in the first direction and extending from an outlet of the first bypass passage in the reverse direction to the second direction, a second distribution passage isolated from the second bypass passage in the first direction and extending from an outlet of the second bypass passage in the second direction, and a plurality of spray holes in an outer surface of the first and second distribution passages and configured to spray the process gas.Type: ApplicationFiled: December 6, 2018Publication date: October 31, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Jong-Hyun LEE, Young-Kwon KIM, Woo-Jae KIM, Seung-Min RYU, Ji-Ho UH
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Publication number: 20190203353Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.Type: ApplicationFiled: July 24, 2018Publication date: July 4, 2019Inventors: IL JUN JEON, Ji Ho Uh, Je Hak Lee, Jun Sung Lee, Ji Woon Im
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Publication number: 20160115583Abstract: A device for vacuum evaporating includes a thermal evaporation module that generates vapor in a vacuum chamber through a circular opening by heating a vapor evaporation material accommodated therein. A moving stage is positioned in an atmospheric area separated from the vacuum chamber and adjusts a position of the thermal evaporation module under the thermal evaporation module. A sealing part is combined with the thermal evaporation module to isolate the vacuum chamber and the atmospheric area from each other and maintain a vacuum state of the vacuum chamber while surrounding the thermal evaporation module and permitting movement of the thermal evaporation module.Type: ApplicationFiled: May 29, 2015Publication date: April 28, 2016Inventors: JI-HO UH, Jun-Sung Lee
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Patent number: 9263414Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.Type: GrantFiled: December 17, 2013Date of Patent: February 16, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyeong Min Yeo, Seung Min Ryu, Dae Jung Kim, Ji Ho Uh, Suk Won Lee
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Publication number: 20140242753Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.Type: ApplicationFiled: December 17, 2013Publication date: August 28, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyeong Min YEO, Seung Min RYU, Dae Jung KIM, Ji Ho UH, Suk Won LEE
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Publication number: 20130255766Abstract: The present inventive concepts provide a conductive paste composition including conductive particles, a thickening agent, a dispersing agent, a thixotropic agent, an organic solvent, and glass frit, wherein the conductive paste composition has a thixotropic index of about 2 to 7 and a viscosity of about 50,000 to 300,000 cps at a temperature of 25° C.Type: ApplicationFiled: March 12, 2013Publication date: October 3, 2013Inventors: Jung-hwan Shin, Yong-in Lee, Jong-woo Lee, Eun-ah Park, Ji-ho Uh, Cecilia Lee
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Patent number: 8482870Abstract: Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.Type: GrantFiled: May 19, 2011Date of Patent: July 9, 2013Assignee: Samsung Electronics Co., Ltd.Inventor: Ji Ho Uh
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Publication number: 20110286118Abstract: Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.Type: ApplicationFiled: May 19, 2011Publication date: November 24, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Ji Ho Uh