Patents by Inventor Ji Hong Jo

Ji Hong Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11469044
    Abstract: A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Du Won Choi, Ji Hong Jo, Seok Kyoon Woo, Hae Suk Chung
  • Publication number: 20220301782
    Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Publication number: 20220293347
    Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.
    Type: Application
    Filed: May 26, 2022
    Publication date: September 15, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong KIM, Ji Hong JO, Woo Chul SHIN
  • Publication number: 20220285099
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.
    Type: Application
    Filed: May 24, 2022
    Publication date: September 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gon LEE, Taek Jung LEE, Jin Man JUNG, Jin Kyung JOO, Ji Hong JO
  • Publication number: 20220262573
    Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 18, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Young KIM, Jae Young NA, Beom Joon CHO, Ji Hong JO, Woo Chul SHIN
  • Patent number: 11410815
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gon Lee, Taek Jung Lee, Jin Man Jung, Jin Kyung Joo, Ji Hong Jo
  • Publication number: 20220246360
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 4, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Jin Soo Park, Ji Hong Jo, Myung Jun Park, Hyun Hee Gu, Jong Ho Lee
  • Publication number: 20220230811
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes with the dielectric layer interposed therebetween, and a first through-electrode passing through the body and connected to the first internal electrode; a second through-electrode passing through the body and connected to the second internal electrode; first and second external electrodes formed on the first and second surfaces and connected to the first through-electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through-electrode, wherein the first to fourth external electrodes are sintered electrodes including nickel, and each comprises a first plating layer and a second plating layer sequentially stacked on the sintered electrodes.
    Type: Application
    Filed: February 23, 2022
    Publication date: July 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Byeong Chan Kwon, Jin Kyung Joo, Ji Hong Jo
  • Publication number: 20220223347
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
  • Patent number: 11387042
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and having first and second surfaces opposing each other in a width direction, third and fourth surfaces connecting the first and second surfaces in a length direction, and fifth and sixth surfaces opposing each other in a thickness direction, internal electrodes disposed inside the ceramic body, exposed through the first and second surfaces, and having one end portion exposed through the third or fourth surface, and first and second side margin portions disposed on edges of the internal electrodes, exposed through the first and second surfaces. In a cross-section cut along a width-thickness plane of the ceramic body, an area of an oxide region disposed on the edges of the internal electrodes is less than 10% of an overall area of the internal electrodes exposed through the first and second surfaces.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: July 12, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Park, Jang Yeol Lee, Ji Hong Jo
  • Patent number: 11380487
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body, and connected to the first and second connection electrodes; and third and fourth external electrodes connected to the third and fourth connection electrodes, and at least a portion of the first and second connection electrodes is exposed to the surface of the body.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: July 5, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gon Lee, Taek Jung Lee, Jin Man Jung, Ji Hong Jo, Jin Kyung Joo
  • Patent number: 11380488
    Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: July 5, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11373808
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: June 28, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Gon Lee, Taek Jung Lee, Jin Man Jung, Jin Kyung Joo, Ji Hong Jo
  • Publication number: 20220199329
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a stacking direction, and including a first surface and a second surface opposing each other in the stacking direction, a first through electrode penetrating the body and connected to the first internal electrode; a second through electrode penetrating the body and connected to the second internal electrode, first and second external electrodes disposed on the first surface and the second surface, respectively, and connected to the first through electrode, third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through electrode, and an identifier disposed on the first surface or the second surface of the body, and the first and second through electrodes protrude from the first surface of the body.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 23, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byeong Chan Kwon, Ji Hong Jo, Min Gon Lee, Jin Kyung Joo, Taek Jung Lee
  • Publication number: 20220181089
    Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5?B/A.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae KIM, Sang Soo PARK, Chan YOON, Woo Chul SHIN, Ji Hong JO
  • Patent number: 11355288
    Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: June 7, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Young Kim, Jae Young Na, Beom Joon Cho, Ji Hong Jo, Woo Chul Shin
  • Patent number: 11355286
    Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 ?m or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: June 7, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Ji Hong Jo, Hyung Soon Kwon, Jong Hoon Kim, Jin Woo Lee
  • Publication number: 20220172893
    Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae KIM, Ji Hong JO, Woo Chul SHIN, Sang Soo PARK, Chan YOON
  • Patent number: 11348732
    Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Patent number: 11348730
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, and a content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Park, Ji Hong Jo, Ki Pyo Hong