Abstract: A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.

Abstract: Provided are an optimization system and method of a deep learning model. According to example embodiments, by optimizing the structure of the deep learning model appropriately for a target dataset without fixing the structure of the deep learning model, it is possible to generate a model structure capable of having high performance on the target dataset and also saving resources.

Abstract: A particle sensing device according to one embodiment comprises: a light-emitting unit for emitting light; a first flow path unit arranged under the light-emitting unit so as to be vertical to an optical shaft of the light-emitting unit, and through which air including particles flows; a light-receiving unit arranged at the optical shaft under the first flow path unit, and on which light that has passed through the first flow path is incident; and a light-absorbing unit arranged at the optical shaft under the light-receiving unit and absorbing light that has passed through the light-receiving unit.

Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.

Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.

Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.

Abstract: An electronic device, according to various embodiments of the present disclosure, may comprise: a housing comprising a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side member having a first thickness in a third direction perpendicular to the first direction, while at least partially enclosing a space between the first plate and the second plate; a display disposed between the first plate and the second plate within the housing; a printed circuit board disposed between the display and the second plate within the housing; and an inner structure disposed between the printed circuit board and the second plate within the housing while having a second thickness in the first direction, wherein the inner structure may comprise a flat portion extending from the side member and made of the same metal material as the side member, and wherein the maximum value of the first thickness may be greater than the maximum value of the second thickness.

Abstract: The present specification relates to a polymer and an organic solar cell including the same.

Abstract: A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.

Abstract: The present specification relates to a composition for an organic material layer of an organic solar cell including an electron donor including a polymer including a first unit represented by Chemical Formula 1, a second unit represented by Chemical Formula 2, and a third unit represented by Chemical Formula 3 or 4; and a non-fullerene-based electron acceptor, and an organic solar cell including the composition.

Abstract: The present invention relates to a composition for liquid crystal polymer synthesis having excellent insulation properties, heat resistance, and processability, a liquid crystal polymer for electrical/electronic products, a polymer resin composition, and a molded product using the same.

Abstract: A testing device for body fluid analysis includes: a sheet unit having a sheet of which a first surface receives body fluid of a user to be deposited thereon; a contact unit having a magnifying lens group for magnifying the body fluid deposited on the sheet, the contact unit being provided with a first side at which the magnifying lens group is placed to face the first surface of the sheet and being provided with a second side at which a guide adhering to a photographing means obtaining an image of the body fluid magnified by the magnifying lens group or coming into contact with around an eye of the user is placed; and a light source unit placed to face a second surface of the sheet of the sheet unit in a direction facing the contact unit with the sheet unit in between.

Abstract: A display device and a method of manufacturing the same are provided. A display device includes: a display panel including a first area, a second area, and a bending area between the first area and the second area; a first polarizing film on a first surface of the first area of the display panel; and a second polarizing film on a first surface of the second area of the display panel, and the first and second polarizing films are spaced apart from each other with the bending area therebetween.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: In a user interface method, system and device in a multitasking environment, it is possible for a user to view all of a plurality of simultaneously executed applications by assigning different display areas to the plurality of applications. In the method, system and device, priorities of applications already being executed and of additional applications for which execution is requested are determined, and a display area size is determined and assigned to each application according to its priority. The system comprises a set-top box for performing the latter functions and a user terminal for transmitting a user request, while the device comprises a control unit for performing the latter functions.

Abstract: The present specification relates to an organic solar cell including a first electrode; a second electrode; and one or more organic material layers including a photoactive layer, wherein the photoactive layer includes an electron donor and an electron acceptor, the electron donor includes a polymer including a first unit represented by Chemical Formula 1; a second unit represented by Chemical Formula 2; and a third unit represented by Chemical Formula 3, and the electron acceptor includes a non-fullerene-based compound.

Abstract: The present specification provides a compound including a unit of Formula 1 and an organic solar cell including the same.

Abstract: The present specification provides a copolymer including: a repeating unit derived from a compound represented by Formula 1; a first conjugated monomer; and a second conjugated monomer different from the first conjugated monomer, and an organic solar cell including the same.

Abstract: The present invention relates to a high power microspeaker having a separate sub-diaphragm on a top end surface of a coil, in addition to a diaphragm and a suspension. The present invention provides a structure in which an acoustic system including a main diaphragm and a conductive suspension of a microspeaker is attached to a top end surface of a coil and a separate sub-diaphragm is attached to the same surface of the coil.

Abstract: A voltage equalizer includes: first, second, and third junction terminals respectively connected to a positive electrode of a first battery module, a positive electrode of a second battery module, and negative electrodes of the first and second battery modules; an equalizer circuit connected between the first and second junction terminals, and the equalizer forming a current path between the first and second junction terminals; a first indicator having a first displaying state that changes according to a voltage difference between the first and second junction terminals; a first comparator for outputting a first output voltage according to an input voltage that is input in proportion to a voltage between the first and third junction terminals; and a second indicator having a second displaying state that changes according to the first output voltage of the first comparator.