Abstract: An embodiment all-solid-state battery includes an anode current collector, a double layer disposed on the anode current collector, a solid electrolyte layer disposed on the double layer, the solid electrolyte layer including a solid electrolyte, a cathode layer disposed on the solid electrolyte layer, the cathode layer including a cathode active material, and a cathode current collector disposed on the cathode layer, wherein the double layer includes a protective layer disposed on the anode current collector and a metal alloy layer disposed on the protective layer, wherein the protective layer includes a reaction product of a conductive material containing a first functional group and a binder containing a second functional group, and wherein the metal alloy layer includes a metal capable of forming an alloy with lithium.

Abstract: Provided are a control method, a control apparatus, a training method, and a training apparatus based on thickness estimation of a wafer substrate. The training method includes generating a training spectrum signal according to a thickness of a wafer substrate using an optical model, generating a training spectrum signal having a noise by applying a noise based on a noise parameter to the training spectrum signal, calculating a similarity between the training spectrum signal having the noise and an actually measured spectrum signal, and when the similarity satisfies a set condition, training a noise reduction model using the training spectrum signal having the noise.

Abstract: Provided is a substrate cleaning apparatus, comprising: a substrate support unit for rotating and holding a substrate; a brush unit for cleaning the substrate with a cleaning brush formed in the form of a roll and rotating in contact with a surface of the substrate; and a vibration sensor installed on the brush unit to detect vibrations generated by the contact of the cleaning brush with the substrate, thereby improving process efficiency by predicting cleaning results before cleaning is completed.

Abstract: The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.

Abstract: An electrode assembly including a separator between a positive electrode and a negative electrode. Each of the positive electrode and the negative electrode includes a base member and an active material layer at at least one side of the base member. The active material layer of the negative electrode includes an alternating arrangement of orientation portions and non-orientation portions. Each of the orientation portions is oriented to have a constant angle with respect to one side of the negative electrode.

Abstract: An electrode assembly including a separator between a positive electrode and a negative electrode. Each of the positive electrode and the negative electrode includes a base member and an active material layer at at least one side of the base member. The active material layer of the negative electrode includes an alternating arrangement of orientation portions and non-orientation portions. Each of the orientation portions is oriented to have a constant angle with respect to one side of the negative electrode.