Abstract: Provided is a power management device including a first power domain operating in a sleep mode consuming minimal power, and a second power domain turned on exclusively when a wake signal is received from an external device within a communication range of the first power domain, wherein the first power domain includes an always-on Digital Low-DropOut (DLDO), and the second power domain includes a main Low-DropOut (LDO), and split sequence control is performed on power management in the first power domain and the second power domain.

Abstract: An electronic device includes a housing, a slot disposed in an interior of the housing, wherein the slot is configured to permit an electronic module inserted into the slot, a cooling member disposed outside the slot to cool the electronic module, and a heat transfer member configured to be connected to the electronic module to transfer heat from the electronic module to the cooling member.

Abstract: A technology related to a transmission device of an amplitude modulation method is disclosed. In the amplitude modulation transmission device, a transmission data signal transformed into a sinusoidal wave transition form is input to a signal input stage of a cascode power amplifier, and a transmission data signal transformed into another sinusoidal wave transition form is input to a bias power stage of the cascode power amplifier. The transmission data signal transformed into the sinusoidal wave transition form has a sinusoidal wave form in a section in which input data transitions and maintain its previous value in a section in which the input data is maintained.

Abstract: A display panel includes pixels, each including a light emitting element and a pixel circuit connected to the light emitting element, data lines arranged in a plurality of columns, where the data lines supply data signals to the pixel circuit, data pads connected to the data lines, a first protection circuit connected between a first data line among the data lines and a first gate power line to which a first gate power voltage is applied, and a second protection circuit connected between a second data line among the data lines and a second gate power line to which a second gate power voltage is applied.

Abstract: A method of programming a three-dimensional semiconductor memory device includes applying a first word line programming voltage to a selected word line among the word lines, floating unselected word lines among the word lines, and applying a back-gate pass voltage to the back-gate electrode; applying a first word line verification voltage to the selected word line, applying a word line pass voltage to the unselected word lines, and applying a first back-gate verification voltage to the back-gate electrode; applying a second word line programming voltage to the selected word line, floating the unselected word lines, and applying the back-gate pass voltage to the back-gate electrode; and applying a second word line verification voltage to the selected word line, applying the word line pass voltage to the unselected word lines, and applying a second back-gate verification voltage to the back-gate electrode.

Abstract: A positive electrode active material for an all-solid-state battery of the present exemplary embodiments may include: a core including a lithium nickel-based oxide; a first coating layer containing cobalt which is placed on a surface of the core; and a second coating layer containing a lithium transition metal oxide which is placed on a surface of the first coating layer.

Abstract: Disclosed is a method for producing hyaluronidase or a variant thereof. Specifically, the method is capable of changing the N-glycan levels under culture conditions including a controlled concentration of glucose in the culture medium and a decreased culture temperature for a specific culture time period, thereby increasing the specific activity by 10% or more and improving the quality and production yield.

Abstract: A gate driver including a plurality of stages, each of the plurality of stages including an eighth transistor connected between a third power input terminal and an output terminal, the eighth transistor including a gate electrode connected to a fourth node, a seventh transistor connected between a second power input terminal and the output terminal, the seventh transistor including a gate electrode connected to a third node, an eleventh transistor connected between the third power input terminal and the fourth node, the eleventh transistor including a gate electrode connected to a first node, a twelfth transistor connected between the first node and the third node, the twelfth transistor including a gate electrode connected to the second power input terminal, and a third capacitor connected between the third power input terminal and the fourth node.

Abstract: A battery SOH estimating apparatus according to an embodiment of the present disclosure includes a SOH estimating unit configured to estimate a first SOH of a battery based on the measured voltage and current of the battery; a SOC change calculating unit configured to calculate a SOC change region and a SOC change amount of the battery based on the measured voltage; a weight calculating unit configured to calculate a weight based on a SOC region factor calculated by comparing the SOC change region with a preset criterion SOC region, a SOC change amount factor based on the SOC change amount, and a temperature factor based on the measured temperature of the battery; and a SOH correcting unit configured to correct the first SOH according to the calculated weight and a preset second SOH.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: A display device includes first and second pixels disposed adjacent to each other. Each of the first and second pixels includes a light-emitting element, a first transistor controlling a driving current flowing in the light-emitting element, a second transistor supplying a data voltage to a first electrode of the first transistor, a third transistor electrically connecting a second electrode of the first transistor and a gate electrode of the first transistor, and a fourth transistor discharging the gate electrode of the first transistor with a first initialization voltage. The first and second pixels share a fourth-first transistor including a first electrode connected to the fourth transistor of the first pixel and the fourth transistor of the second pixel, and a second electrode connected to a first initialization voltage line supplying the first initialization voltage.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: Provided is a device-to-device (D2D)-based wireless power receiving device including an observation part configured to monitor a battery, an estimator configured to estimate usage and a workload of the battery on the basis of a result of monitoring the battery, a mode determiner configured to determine required power of the battery on the basis of the usage and the workload, and determine a reception mode according to the required power, and a power receiver configured to wirelessly receive power from another device according to the reception mode. Accordingly, wireless power charging efficiency can be maximized.

Abstract: A fluid spray device for processing a substrate according to the present invention includes a spray nozzle configured to spray a processing fluid toward a substrate supported on a table, and a scattering prevention cover configured to block contaminants from being scattered by the sprayed processing fluid hitting the substrate.

Abstract: System and method for detecting and classifying direct response advertisements.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.