Patents by Inventor Ji Hoon Yun
Ji Hoon Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10869013Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.Type: GrantFiled: July 18, 2019Date of Patent: December 15, 2020Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGYInventor: Ji Hoon Yun
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Publication number: 20200328329Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: June 26, 2020Publication date: October 15, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong II KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Publication number: 20200251643Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: April 21, 2020Publication date: August 6, 2020Inventors: Ji-hoon YUN, Jong-sup SONG, Seol-young CHOI
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Publication number: 20200220707Abstract: A backscatter communication method and apparatus based on pattern-based demodulation is disclosed. The backscatter communication method includes receiving a communication signal, and demodulating the communication signal based on a slope of the communication signal at an edge of each time interval.Type: ApplicationFiled: August 16, 2019Publication date: July 9, 2020Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Byung Jang JEONG, Jae-Han LIM, Hwanwoong HWANG, Ji-Hoon YUN
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Patent number: 10700246Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: GrantFiled: March 12, 2019Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun Sim, Yong Il Kim, Ha Nul Yoo, Ji Hye Yeon, Jun Bu Youn, Ji Hoon Yun, Su Hyun Jo
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Publication number: 20200162712Abstract: Provided is a method for creating a virtual reality content, storing the virtual reality content in a transmission buffer, and after that, managing the transmission buffer. A server creates the virtual reality content based on user's motion information, stores the virtual reality content in the transmission buffer and is allowed to modify the virtual reality content stored in the transmission buffer based on subsequently received user's motion information, so that the most recent user's motion information can be appropriately reflected in the virtual reality content. It is possible to provide a more immersive virtual reality service.Type: ApplicationFiled: July 18, 2019Publication date: May 21, 2020Applicant: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGYInventor: Ji Hoon YUN
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Publication number: 20200105980Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.Type: ApplicationFiled: March 12, 2019Publication date: April 2, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hyun SIM, Yong Il KIM, Ha Nul YOO, Ji Hye YEON, Jun Bu YOUN, Ji Hoon YUN, Su Hyun JO
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Publication number: 20200058839Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: August 26, 2019Publication date: February 20, 2020Inventors: JI-HOON YUN, Jong-sup SONG, Seol-young CHOI
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Patent number: 10510936Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: October 27, 2017Date of Patent: December 17, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Publication number: 20190253135Abstract: Disclosed are a communication method and communication apparatus using an ambient backscatter communication. A transmission apparatus may include generating a plurality of bitsets by fragmenting data based on a predetermined bitset length, mapping the plurality of bitsets to a plurality of switching patterns based on a data size, and controlling a reflection of a background radio frequency (RF) signal based on a corresponding mapped switching pattern, a total number of the plurality of switching patterns may be determined based on the bitset length, and each of the plurality of switching patterns may have a different length.Type: ApplicationFiled: November 28, 2018Publication date: August 15, 2019Applicants: Electronics and Telecommunications Research Institute, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Byung Jang JEONG, Woo Jin BYUN, Ji-Hoon YUN, Jae-Han LIM, Wisnu MURTI
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Patent number: 10215365Abstract: A lighting device in which a heat sink and a cover are formed by co-extrusion and a manufacturing method for the same are provided. The heat sink and the cover may be co-extruded. A shape control portion may be formed at the heat sink to control a shape of a seating portion to seat a circuit substrate during extrusion of the heat sink. In addition, a light characteristic control portion may be provided between a light emitting diode (LED) and the cover to control characteristic of light generated from the LED.Type: GrantFiled: March 27, 2013Date of Patent: February 26, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byeong Hyeon Yu, Wook Pyo Lee, Ariyoshi Tetsuo, Ji Hoon Yun, Cheon Ho Park
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Publication number: 20180315912Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: October 27, 2017Publication date: November 1, 2018Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Patent number: 9680074Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: GrantFiled: March 2, 2016Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon Yun, Jong Sup Song, Soo Hwan Lee, Saesil Kim, Mi Jeong Yun
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Patent number: 9568156Abstract: A light source module including a substrate, a plurality of light emitting devices installed on the substrate, and a plurality of lenses installed on the substrate to cover the plurality of light emitting devices, respectively, and each of the plurality of lenses having a pair of open end portions facing one another, the plurality of lenses arranged such that an open end portion of one lens faces an opened end portion of an adjacent lens is provided.Type: GrantFiled: December 19, 2013Date of Patent: February 14, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Ariyoshi Tetsuo, Cheon Ho Park, Jong Pil Won, Ji Hoon Yun, Jun Ho Jung
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Publication number: 20160380169Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: ApplicationFiled: March 2, 2016Publication date: December 29, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon YUN, Jong Sup SONG, Soo Hwan LEE, Saesil KIM, Mi Jeong YUN
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Patent number: 9326309Abstract: Disclosed are various example embodiments of link connection for a multi-mode terminal. In an example embodiment, an operating method of multi-mode terminal comprises connecting a first type link with a first type access point of an integrated access point; reading link setup information corresponding to the integrated access point from a memory, wherein the link setup information is used for configuring a second type link according to a first configuration method; and connecting a second type link with a second type access point of the integrated access point based on the link setup information.Type: GrantFiled: April 29, 2014Date of Patent: April 26, 2016Assignee: INTELLECTUAL DISCOVERY CO., LTD.Inventor: Ji Hoon Yun
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Patent number: 8956011Abstract: A bulb-type semiconductor light-emitting device lamp having wide light distribution characteristics which are similar to those of a typical incandescent bulb is provided. The semiconductor light-emitting device lamp includes: a plurality of light-emitting devices that are arranged such that light is emitted therefrom toward a central axis of the bulb-type semiconductor light-emitting device lamp. Also, the bulb-type semiconductor light-emitting device lamp includes a heat dissipation structure having a plurality of installation surfaces that surround the central axis and are separated from each other, wherein each of the plurality of light-emitting devices includes one or more light-emitting devices.Type: GrantFiled: August 29, 2012Date of Patent: February 17, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Tetsuo Ariyoshi, Cheon-ho Park, Byeong-hyeon Yu, Ji-hoon Yun
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Publication number: 20150022999Abstract: A lighting device in which a heat sink and a cover are formed by co-extrusion and a manufacturing method for the same are provided. The heat sink and the cover may be co-extruded. A shape control portion may be formed at the heat sink to control a shape of a seating portion to seat a circuit substrate during extrusion of the heat sink. In addition, a light characteristic control portion may be provided between a light emitting diode (LED) and the cover to control characteristic of light generated from the LED.Type: ApplicationFiled: March 27, 2013Publication date: January 22, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byeong Hyeon Yu, Wook Pyo Lee, Ariyoshi Tetsuo, Ji Hoon Yun, Cheon Ho Park
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Publication number: 20140323131Abstract: Disclosed are various example embodiments of link connection for a multi-mode terminal. In an example embodiment, an operating method of multi-mode terminal comprises connecting a first type link with a first type access point of an integrated access point; reading link setup information corresponding to the integrated access point from a memory, wherein the link setup information is used for configuring a second type link according to a first configuration method; and connecting a second type link with a second type access point of the integrated access point based on the link setup information.Type: ApplicationFiled: April 29, 2014Publication date: October 30, 2014Applicant: INTELLECTUAL DISCOVERY CO., LTD.Inventor: Ji Hoon YUN
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Patent number: 8801218Abstract: A lighting device including: a light-emitting device unit including one or more light-emitting devices; a first reflector which faces the light-emitting device unit and reflects light emitted from the light-emitting device unit; and a second reflector which faces the first reflector and reflects light reflected by the first reflector.Type: GrantFiled: September 14, 2012Date of Patent: August 12, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Tetsuo Ariyoshi, Cheon-ho Park, Byeong-hyeon Yu, Ji-hoon Yun