Patents by Inventor Ji Hun BANG

Ji Hun BANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009289
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: June 11, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 11984338
    Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: May 14, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn Gon Oh, Ji Hun Kim, Seung Gu Bang, Sung-Hoon Lee, Ho Chan Lee, Hyeong Seok Choo
  • Publication number: 20160160250
    Abstract: Provided are a Hyphomicrobium sp. mutant strain SWB-P91 (KCTC12695BP) having high productivity of pyrroloquinoline quinone, and a method of producing a Hyphomicrobium sp. mutant strain SWB-P91 (KCTC12695BP), which includes inducing mutation by treating a Hyphomicrobium sp. parent strain with N-methyl-N?-nitro-N-nitroguanidine (NTG) and UV rays, and culturing the mutant strain in a medium and selecting a mutant strain with high productivity of pyrroloquinoline quinone. Also, provided is a method of mass-producing pyrroloquinoline quinone, which includes culturing a Hyphomicrobium sp. mutant strain, SWB-P91 (KCTC12695BP), adsorbing pyrroloquinoline quinone in a fermenting culture solution from the fermenting culture solution using an adsorption resin, detaching the adsorbed pyrroloquinoline quinone with an eluent; and recovering pyrroloquinoline quinone by vacuum-evaporating the detached pyrroloquinoline quinone solution.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 9, 2016
    Inventors: In Wha JUNG, Hyung Wook JANG, Joon Ki JUNG, In Gyu LEE, Chang Jae MAENG, Ji Hun BANG, Seog Sook NA