Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.

Abstract: An electronic vaporizer for generating an aerosol includes a housing to be installed to an electronic device by being coupled to the electronic device through a connecting interface of the electronic device, and including: a connecting interface that receives power from a battery included in the electronic device when coupled to the connecting interface of the electronic device, a liquid storage for storing a liquid aerosol generating material and supplying the liquid aerosol generating material to a wick when the housing is disposed in a predetermined posture, an atomizer that includes a wick and a heater for generating an aerosol by heating the liquid aerosol generating material supplied to the wick, and a control circuit that controls heating of the heater for generating the aerosol, based on the power supplied from the battery.

Abstract: Provided is a sterilizing device including a wall portion defining an inner space together with a floor where an article to be sterilized and disinfected is located, and a cover located on the wall portion and covering the inner space, wherein each of the cover and the wall portion includes a first film having a plurality of micro nozzles for electrostatically spraying water into the inner space, and light-emitting elements for irradiating ultraviolet light to the article.

Abstract: Provided are an electrostatic spray nozzle film and an electrostatic spray system. The electrostatic spray nozzle film includes a first film including a first base layer and a plurality of nozzles in such a configuration that each of the plurality of nozzles protrudes outward from a surface of the first base layer, has a truncated column shape, and has a first opening therein penetrating through the first base layer; a second film including a second base layer positioned on the first film and a plurality of surrounding electrodes positioned on the second base layer and corresponding to the nozzles, respectively; and a third film positioned on the second film and having a flow path through which water for an electrostatic spray flows, wherein in a plain view, the plurality of surrounding electrodes are arranged to surround the nozzles, respectively, and a same voltage is applied to the plurality of surrounding electrodes.

Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes, and external electrodes, wherein the body has first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A length of a portion of the plurality of internal electrodes in the third direction in an intermediate region of the body in the first direction is greater than a length of the first surface or the second surface of the body in the third direction. The plurality of internal electrodes have a bottleneck structure between the intermediate region and at least one of the first and second surfaces, and wherein the bottleneck structure has a shape recessed into an inner portion of the body.

Abstract: The present disclosure provides a polishing pad and a method of manufacturing a semiconductor device using the same. The method includes disposing a target layer on a semiconductor substrate and performing a chemical mechanical polishing process on the target layer using a polishing pad including a plurality of polishing protrusions facing the target layer. Each of the polishing protrusions includes a protruding portion and a surface layer at least partially covering the protruding portion, wherein the protruding portion is more elastic than the surface layer, and wherein the surface layer is harder than the protruding portion.

Abstract: Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

Abstract: Various embodiments of the present disclosure relate to a fixed-abrasive pad using vertically aligned carbon nanotubes and a fabrication method for the same. The fixed-abrasive pad may include a pad made of a polymer material; and vertically aligned carbon nanotubes (VACNT) which are configured such that one side thereof is impregnated into the pad and the other side protrudes from the pad.

Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes, and external electrodes, wherein the body has first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A length of a portion of the plurality of internal electrodes in the third direction in an intermediate region of the body in the first direction is greater than a length of the first surface or the second surface of the body in the third direction. The plurality of internal electrodes have a bottleneck structure between the intermediate region and at least one of the first and second surfaces, and wherein the bottleneck structure has a shape recessed into an inner portion of the body.

Abstract: The present disclosure relates to an anode for a lithium-metal battery, a manufacturing method of the same, and a lithium-metal battery including the anode. The anode for a lithium-metal battery includes a complex hierarchical structure current collector which includes an inverted pyramid-shaped micro hole pattern and nanostructures provided within the inverted pyramid-shaped micro hole pattern; and a lithium metal which is electrodeposited on the nanostructure of the current collector. As a result, it is possible to increase the life stability of the battery and increase the coulombic efficiency.

Abstract: A packing box includes first and second sidewall parts spaced apart and facing each other, first and second connecting parts, a third connecting part attaching the second connecting part to the first sidewall part, a bottom part connecting lower portions of the first and second sidewall parts and the first and second connecting parts, and a top part facing the bottom part and connecting upper portions of the first and second sidewall parts and the first and second connecting parts to form a receiving space. The top part includes first to fourth upper paperboards folded and extended from the upper portions of the first and second sidewall parts and the first and second connecting parts to form a handle, and a fifth upper paperboard folded from the third connecting part and disposed under the first to fourth upper paperboards to prevent withdrawal of contents from the receiving space.

Abstract: A packing box includes first and second sidewall parts spaced apart and facing each other, first and second connecting parts, a third connecting part attaching the second connecting part to the first sidewall part, a bottom part connecting lower portions of the first and second sidewall parts and the first and second connecting parts, and a top part facing the bottom part and connecting upper portions of the first and second sidewall parts and the first and second connecting parts to form a receiving space. The top part includes first to fourth upper paperboards folded and extended from the upper portions of the first and second sidewall parts and the first and second connecting parts to form a handle, and a fifth upper paperboard folded from the third connecting part and disposed under the first to fourth upper paperboards to prevent withdrawal of contents from the receiving space.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes stacking dielectric sheets on which internal electrode patterns are printed, to form a multilayer body, forming additional dielectric sheets on portions of opposite side surfaces of the multilayer body, and sintering the multilayer body to form a ceramic body in which internal electrodes are disposed. Here, the additional dielectric sheets form attachment parts on the opposite side surfaces of the ceramic body by the sintering of the multilayer body.

Abstract: Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding one of the plurality of dielectric layers and having uneven portions formed at an edge thereof, the internal electrode having a connectivity of between 0.7 and 0.9, which is defined by an equation below, and an external electrode formed on an outer surface of the ceramic body and connected with the internal electrode, Z=X?Y/X ??(Equation) where X denotes a length of a cross-section of the internal electrode in one direction, Y denotes a total length of gaps formed by holes in the cross-section, and Z denotes the connectivity of the internal electrode. The multilayer ceramic capacitor achieves a low crack generation rate and a high level of reliability.

Abstract: Disclosed is a multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitive part including a plurality of dielectric layers and first and second internal electrodes that are laminated in an alternating manner, wherein one set of ends of the first internal electrodes and the other set of ends of the second internal electrodes are exposed in a lamination direction in which the dielectric layers are laminated, a protective layer formed on at least one of top and bottom surfaces of the capacitive part, including a plurality of pores having an average pore size of 0.5 ?m to 3 ?m, and having a porosity of 2% to 10%, and first and second external electrodes electrically connected to the first and second internal electrodes exposed in the lamination direction of the dielectric layers.

Abstract: Disclosed is multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitive part including dielectric layers and first and second internal electrodes alternately laminated therein, wherein the dielectric layers include first ceramic particles having an average particle size of 0.1 ?m to 0.3 ?m, and one set of ends of the first internal electrodes and one set of ends of the second internal electrodes are exposed in a lamination direction of the dielectric layers, a protective layer formed on at least one of top and bottom surfaces of the capacitive part, including second ceramic particles and having a porosity of 2% to 4%, wherein an average particle size ratio of the second ceramic particles to the first ceramic particles ranges from 1.1 to 1.3; and first and second external electrodes electrically connected to the first and second internal electrodes exposed in the lamination direction of the dielectric layers.

Abstract: There is provided a multilayer ceramic capacitor including: a capacitor main body formed by stacking a dielectric layer having a thickness of td and alternately stacking more than one opposing pair of a first internal electrode having a thickness of te and a second internal electrode having the same thickness as the first internal electrode, and having the dielectric layer therebetween; and a protective layer formed by stacking a second dielectric layer on at least one of an upper surface and a lower surface of the capacitor main body so that a dielectric material layer has a thickness of tc, wherein when a thickness from an end of a region where the first internal electrode and the second internal electrode oppose each other to side and end surfaces of the capacitor main body is a, it satisfies the following Equation 1 and a method of fabricating a multilayer ceramic capacitor are provided.

Abstract: A multilayer ceramic capacitor includes a capacitor body in which inner electrodes and dielectric layers are alternately laminated, and a length difference rate (D) of the inner electrodes is 7% or less. The length difference rate (D) is defined by D={L?1}/L×100, where L is a maximum length of the inner electrode, and l is a minimum length of the inner electrode.

Abstract: Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding one of the plurality of dielectric layers and having uneven portions formed at an edge thereof, the internal electrode having a connectivity of between 0.7 and 0.9, which is defined by an equation below, and an external electrode formed on an outer surface of the ceramic body and connected with the internal electrode, Z=X?Y/X ??(Equation) where X denotes a length of a cross-section of the internal electrode in one direction, Y denotes a total length of gaps formed by holes in the cross-section, and Z denotes the connectivity of the internal electrode. The multilayer ceramic capacitor achieves a low crack generation rate and a high level of reliability.

Abstract: There is provided a multilayer ceramic capacitor and a method of manufacturing the same. There is provided a multilayer ceramic capacitor, including: a ceramic body having a plurality of dielectric layers stacked therein and including a first side and a second side opposite to each other and a third side and a fourth side connected to the first side and the second side; and inner electrode layers formed on the dielectric layers, including electrode drawing parts exposed to the first side or the second side and an electrode main part, and having a length between the electrode main part and the third side of 100 ?m or less and a ratio of a length between the electrode drawing part and the third side to the length between the electrode main part and the third side of between 1.2:1 and 1.7:1. The multilayer ceramic capacitor may have improved reliability by suppressing cracks occurring in the ceramic laminate due to thermal impact during a sintering or mounting process.