Abstract: The present disclosure relates to a portable printer including a main body in a portable form which is capable of accommodating a cartridge having a nozzle for delivering a printing material to a target having a soft or hard surface, a seating part which is provided to be exposed to an outside from a lower portion of the main body to face the surface of the target and at least partially surrounds the nozzle, a roller provided respectively at the front and rear of the nozzle at the lower portion of the main body with respect to a direction in which the main body moves along the surface of the target to deliver the printing material to the target, and a printing adjustment unit configured to adjust a height difference between the nozzle and the roller to adjust a height difference between the nozzle and the surface of the target.

Abstract: An integrated circuit includes an operational circuit and a test circuit for measuring a leakage current associated with all or part of the operational circuit. The leakage current measurement circuit may include a mirror circuit configured to mirror leakage current to a current-to-voltage converter and an analog-to-digital converter configured to convert the analog voltage representative of the leakage current developed by the current-to-voltage converter to a digital value.

Abstract: An integrated circuit includes an operational circuit and a test circuit for measuring a leakage current associated with all or part of the operational circuit. The leakage current measurement circuit may include a mirror circuit configured to mirror leakage current to a current-to-voltage converter and an analog-to-digital converter configured to convert the analog voltage representative of the leakage current developed by the current-to-voltage converter to a digital value.

Abstract: A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.

Abstract: A method of verifying operation of an oscillator includes performing a Monte-Carlo simulation with respect to points in an initial-conditions space, and then judging whether a frequency error exists. An oscillation error is determined to exist when the frequency error exists. Additional operations include determining a point at which a probability of having a settling time longer than a maximum value, of a settling time obtained up to a present time, is maximum when the frequency error does not exist. The Monte-Carlo simulation is then performed on the determined point to judge whether the frequency error exists.

Abstract: A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.