Abstract: Disclosed are a method of manufacturing ultra fine metal powder used for an electrode for an MLCC and ultra fine metal powder manufactured by the same. The method of manufacturing ultra fine metal powder includes: preparing a master mold in which a pattern is formed; forming a sacrificial layer by applying a polymer material on the pattern; forming a metal layer on the sacrificial layer; and forming individual ultra fine metal powder by removing the sacrificial layer and separating the metal layer from the master mold.

Abstract: The present invention provides a method for preparing metal powder, which includes the steps of: providing a base substrate; forming a pattern layer, having a concave-convex pattern of a predetermined shape, on the base substrate; forming a metal film separated from the pattern layer by the concave-convex pattern; and separating the metal film from the pattern layer, thereby naturally patterning the metal film in the predetermined shape, and a method for manufacturing inner electrodes of a multilayer ceramic capacitor using the same.

Abstract: Disclosed herein are a member for adjusting horizontality and a probe card with the same. The member for adjusting horizontality according to the present invention horizontally couples a micro probe head to a probe substrate with an adhesive layer therebetween, and the member for adjusting horizontality which is coupled to the micro probe head does not have an edge of the coupling portion and an edge of the adhesive layer. Therefore, according to the member for adjusting horizontality and the probe card with the same of the present invention, it is possible to prevent the coupling portions of the micro probe head from being broken, by reducing stress applied to the micro probe head during the process of horizontally coupling the micro probe head to the probe substrate.

Abstract: There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess.

Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Abstract: Provided is a shutter device including a coil layer that includes one or more substrates having a through-hole formed in the center thereof and a coil installed thereon, the coil generating a magnetic field when a current is applied; and a shutter layer that is installed on one surface of the coil layer and includes a shutter case having a shape corresponding to the substrate and a pair of shutter blades which are connected to flexible suspensions formed in the shutter case, respectively. The shutter blades open and close the through-hole of the substrate, while being moved in the reverse direction to each other by an electromagnetic force caused by an interaction with the magnetic field generated by the coil and returning to the original position due to the recovery force of the flexible suspensions when the electromagnetic force is canceled.

Abstract: Provided is a shutter device including a coil layer that includes one or more substrates having a through-hole formed in the center thereof and a coil installed thereon, the coil generating a magnetic field when a current is applied; and a shutter layer that is installed on one surface of the coil layer and includes a shutter case having a shape corresponding to the substrate and a pair of shutter blades which are connected to flexible suspensions formed in the shutter case, respectively. The shutter blades open and close the through-hole of the substrate, while being moved in the reverse direction to each other by an electromagnetic force caused by an interaction with the magnetic field generated by the coil and returning to the original position due to the recovery force of the flexible suspensions when the electromagnetic force is canceled.

Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Abstract: Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.

Abstract: Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.

Abstract: In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Abstract: Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.

Abstract: Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.

Abstract: A method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter are disclosed, in which when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, that a cost curtail and a workability improvement can be realized, and that the sealing can be made sure. The first sealing is carried out on a step which is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.