Patents by Inventor Ji Hye NAM
Ji Hye NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151360Abstract: A hydrogen supply method includes a two-side heat exchange mode in which both introducing a second fluid into a hydrogen storage part after the second fluid exchanges heat with a first fluid in a second heat exchanger in a state in which a compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device are performed. The method also includes a one-side heat exchange mode in which one of introducing the second fluid into the hydrogen storage part after the second fluid exchanges heat with the first fluid in the second heat exchanger in a state in which the compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device is performed.Type: ApplicationFiled: August 30, 2023Publication date: May 9, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ho Young Jeong, Hoon Mo Park, Kyung Moon Lee, Yeon Ho Kim, Ji Hye Park, Jae Yeon Kim, Dong Hoon Nam
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Publication number: 20240151361Abstract: A hydrogen supply method includes a two-side heat exchange mode in which both introducing a second fluid into a hydrogen storage part after the second fluid exchanges heat with a first fluid in a second heat exchanger in a state in which a compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in a thermal device are performed. The method also includes a one-side heat exchange mode in which one of introducing the second fluid into the hydrogen storage part after the second fluid exchanges heat with the first fluid in the second heat exchanger in a state in which the compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device is performed.Type: ApplicationFiled: August 30, 2023Publication date: May 9, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Yeon Ho Kim, Hoon Mo Park, Kyung Moon Lee, Dong Hoon Nam, Ji Hye Park, Young Jin Cho, Jea Wan Kim, Byeong Soo Shin, Ji Hoon Lee, Ho Young Jeong, Suk Hoon Hong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Ho Chan An
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Publication number: 20240151436Abstract: A hydrogen compression system includes: a heat pump part including a heat pump line configured to allow a refrigerant to circulate therethrough, a hydrogen compression part configured to compress hydrogen by being repeatedly heated and cooled, a first circulation line connected to the heat pump line while passing through the hydrogen compression part and configured to allow the refrigerant introduced from the heat pump line to circulate therethrough, a second circulation line provided to pass through the hydrogen compression part and configured to allow a cooling fluid to circulate therethrough, and a cooling unit provided in the second circulation line and configured to cool the cooling fluid, in which the hydrogen compression part is heated by the refrigerant or cooled by the cooling fluid, thereby minimizing electric power consumption and improving energy efficiency.Type: ApplicationFiled: June 23, 2023Publication date: May 9, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, GRZ TECHNOLOGIES SAInventors: Ji Hye Park, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Hoon Mo Park, Byeong Soo Shin, Krzysztof Romanowicz, Claudio Ruch, Noris Gallandat
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Publication number: 20240117941Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.Type: ApplicationFiled: March 10, 2023Publication date: April 11, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
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Publication number: 20240117930Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.Type: ApplicationFiled: March 10, 2023Publication date: April 11, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
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Publication number: 20230022852Abstract: A lens includes a lens unit, an uneven layer formed on at least a portion of a surface of the lens unit, a buffer layer covering the uneven layer and having a shape conforming to an uneven surface of the uneven layer, and a water-repellent layer covering the buffer layer.Type: ApplicationFiled: May 23, 2022Publication date: January 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Kyung LEE, Ji Hye NAM, Hye Lee KIM, Jong Hyouk KIM, Jong Won YUN, Seong Ho EOM, Seong Chan PARK, Yong Joo JO
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Patent number: 10298204Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.Type: GrantFiled: September 21, 2016Date of Patent: May 21, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yun Sung Kang, Ji Hye Nam, Kwang Su Kim, Pil Joong Kang, Jeong Il Lee
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Patent number: 10211808Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.Type: GrantFiled: September 27, 2016Date of Patent: February 19, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yun Sung Kang, Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Suong Yang, Jeong Il Lee, Jong Hyeong Song
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Patent number: 10068820Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: GrantFiled: November 9, 2017Date of Patent: September 4, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
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Publication number: 20180068915Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: ApplicationFiled: November 9, 2017Publication date: March 8, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE
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Patent number: 9842787Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: GrantFiled: September 26, 2016Date of Patent: December 12, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
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Publication number: 20170271222Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: ApplicationFiled: September 26, 2016Publication date: September 21, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE
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Publication number: 20170237410Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.Type: ApplicationFiled: September 21, 2016Publication date: August 17, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yun Sung KANG, Ji Hye NAM, Kwang Su KIM, Pil Joong KANG, Jeong Il LEE
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Publication number: 20170230032Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.Type: ApplicationFiled: September 27, 2016Publication date: August 10, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yun Sung KANG, Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Suong YANG, Jeong Il LEE, Jong Hyeong SONG