Patents by Inventor Ji Hyeon Lee

Ji Hyeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230253655
    Abstract: Provided is a case for a secondary battery accommodating an electrode assembly, including a lower member, an upper member disposed above the lower member, and a sealing part to which the lower member and the upper member are fused to seal the case. The sealing part includes a first sealing part in which an electrode terminal connected to the electrode assembly exists and a second sealing part which is a remaining area except for the first sealing part. The case includes a polymer resin layer formed on an edge of the first sealing part and a reinforcing layer surrounding the polymer resin layer. The case for a secondary battery has improved water resistance, insulation and mechanical properties. Also provided is a secondary battery, a module, and a device including the same.
    Type: Application
    Filed: December 21, 2022
    Publication date: August 10, 2023
    Inventors: Kyu Beom Kim, Chae Rin Ryou, Jeong Hyeon Yun, Hyea Won Yun, Ji Hyeon Lee, Jong Chan Im
  • Publication number: 20230238625
    Abstract: According to an embodiment of the present disclosure, there are provided a pouch-type secondary battery, including an electrode assembly, and a pouch film including an accommodating part in which the electrode assembly is disposed and a sealing part formed by fusion of edges of the accommodating part, wherein the sealing part includes a pattern sealing part on one or more sides among four sides of the pouch-type secondary battery, and the pattern sealing part includes a plurality of sealings provided with one or more discontinuous parts, and a battery module including the pouch-type secondary battery as a unit cell.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 27, 2023
    Inventors: Jeong Hyeon YUN, Kyu Beom KIM, Chae Rin RYOU, Hyea Won YUN, Ji Hyeon LEE, Jong Chan IM
  • Patent number: 10978477
    Abstract: A three-dimensional semiconductor device includes gate electrodes including pad regions sequentially lowered by a first step portion in a first direction and sequentially lowered by a second step portion in a second direction perpendicular to the first direction, the second step portion being lower than the first step portion, wherein a length of a single pad region among pad regions sequentially lowered by the second step portion in the second direction is less than a length of a remainder of the pad regions in the second direction.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Hwan Lee, Jee Yong Kim, Seok Jung Yun, Ji Hyeon Lee
  • Publication number: 20200051998
    Abstract: A three-dimensional semiconductor device includes gate electrodes including pad regions sequentially lowered by a first step portion in a first direction and sequentially lowered by a second step portion in a second direction perpendicular to the first direction, the second step portion being lower than the first step portion, wherein a length of a single pad region among pad regions sequentially lowered by the second step portion in the second direction is less than a length of a remainder of the pad regions in the second direction.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Inventors: Jung Hwan LEE, Jee Yong KIM, Seok Jung YUN, Ji Hyeon LEE
  • Patent number: 10453857
    Abstract: A three-dimensional semiconductor device includes gate electrodes including pad regions sequentially lowered by a first step portion in a first direction and sequentially lowered by a second step portion in a second direction perpendicular to the first direction, the second step portion being lower than the first step portion, wherein a length of a single pad region among pad regions sequentially lowered by the second step portion in the second direction is less than a length of a remainder of the pad regions in the second direction.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Hwan Lee, Jee Yong Kim, Seok Jung Yun, Ji Hyeon Lee
  • Publication number: 20190043880
    Abstract: A three-dimensional semiconductor device includes gate electrodes including pad regions sequentially lowered by a first step portion in a first direction and sequentially lowered by a second step portion in a second direction perpendicular to the first direction, the second step portion being lower than the first step portion, wherein a length of a single pad region among pad regions sequentially lowered by the second step portion in the second direction is less than a length of a remainder of the pad regions in the second direction.
    Type: Application
    Filed: March 22, 2018
    Publication date: February 7, 2019
    Inventors: Jung Hwan LEE, Jee Yong KIM, Seok Jung YUN, Ji Hyeon LEE
  • Publication number: 20130251890
    Abstract: A method of preparing a porous separator using cellulose nanofibrils is provided. The method includes preparing a sheet using a solution including cellulose nanofibrils and a pore-forming resin and removing the pore-forming resin included in the sheet to form micropores.
    Type: Application
    Filed: April 5, 2011
    Publication date: September 26, 2013
    Applicant: The Republic of Korea (Forestry Administration Forestry Research Institute)
    Inventors: Ji Hyeon Lee, Sang Jin Chun, Cheol Su Jung, Sun Young Lee, Geum Hyun Doh
  • Patent number: D995131
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 15, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Seong Rock Jeong, Woo Soon Choi, Yun Jeong Hwang, Ji Hyeon Lee
  • Patent number: D994360
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 8, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Seong Rock Jeong, Woo Soon Choi, Yun Jeong Hwang, Ji Hyeon Lee