Abstract: An apparatus for fabricating semiconductor devices includes a spin chuck configured for mounting a wafer thereon and operative to rotate the wafer. A nozzle is arranged above the spin chuck, through which a solution is supplied to a surface of the wafer mounted on the spin chuck. A bowl surrounds the spin chuck to prevent the solution from reaching an inner wall of a process chamber. A cover is spaced apart from and confronts the spin chuck having the wafer mounted thereon. The cover has an opening through which a distal end of the nozzle passes so as to spray the solution onto the wafer surface while the cover is disposed over the wafer surface. The cover prevents any solution reflected back from the bowl from reaching the wafer surface.