Patents by Inventor Ji Hyun EOM
Ji Hyun EOM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935458Abstract: A display device includes: a first pixel connected to a first data line and a first scan line; a second pixel connected to the first data line and a second scan line; a first scan driver connected to a first scan start line and the first scan line; and a second scan driver connected to a second scan start line and the second scan line. In a first frame period, the second scan start line is to be suppled with a second scan start signal having a turn-on level, after a first period elapses after a first scan start signal having a turn-on level is supplied to the first scan start line. In a second frame period, a difference between a time at which the first scan start signal having the turn-on level is supplied and a time at which the second scan start signal having the turn-on level is supplied corresponds to a second period. The second period is shorter than the first period.Type: GrantFiled: June 27, 2022Date of Patent: March 19, 2024Assignee: Samsung Display Co., Ltd.Inventors: Ji Hyun Ka, Ki Myeong Eom, Kyong Hwan Oh, Hai Jung In
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Patent number: 11928994Abstract: A display device includes a substrate including a display area and a non-display area disposed near the display area, a plurality of pixels disposed in the display area, a plurality of signal lines disposed on the substrate and connected to the pixels, and a pad portion disposed in the non-display area and including a plurality of pads. The signal lines include a first crack detecting line connected to a first test voltage pad and a first pad at a first node, connected to a second pad at a second node, and extending around the non-display area between the first node and the second node, as well as a first data line including a first end connected to a first transistor connected to the first crack detecting line at the second node, and a second end connected to corresponding pixels from among the plurality of pixels.Type: GrantFiled: June 4, 2019Date of Patent: March 12, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Kwang Sae Lee, Ji-Hyun Ka, Won Kyu Kwak, Hwa Young Song, Ki Myeong Eom
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Patent number: 11922884Abstract: A display device includes: a first pixel including a first organic light emitting diode; an initialization voltage generator for generating a first initialization voltage to be supplied to an anode of the first organic light emitting diode; and a timing controller including a first lookup table in which a plurality of first initialization voltage values corresponding to a plurality of maximum luminances are recorded, the timing controller being configured to determine a value of the first initialization voltage, based on reception information on a target maximum luminance and the first lookup table.Type: GrantFiled: February 17, 2023Date of Patent: March 5, 2024Assignee: Samsung Display Co., Ltd.Inventors: Ji Hyun Ka, Seung Ji Cha, Mi Hae Kim, Ki Myeong Eom
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Patent number: 11721468Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.Type: GrantFiled: June 25, 2020Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwi Jong Lee, Jung Min Kim, Sung Jin Huh, Jin Hyuck Yang, Jae Wook Lee, Ji Hyun Eom
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Patent number: 11270829Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: GrantFiled: October 25, 2019Date of Patent: March 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Sam Lee, Eo Jin Choi, Jae Hun Kim, Ji Hyun Eom, Hye Yeon Cha
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Publication number: 20210202148Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.Type: ApplicationFiled: June 25, 2020Publication date: July 1, 2021Inventors: Kwi Jong LEE, Jung Min KIM, Sung Jin HUH, Jin Hyuck YANG, Jae Wook LEE, Ji Hyun EOM
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Publication number: 20200058431Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Yong Sam LEE, Eo Jin CHOI, Jae Hun KIM, Ji Hyun EOM, Hye Yeon CHA
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Patent number: 10546680Abstract: A coil electronic component includes coil parts formed on both surfaces of a support part and a magnetic body enclosing the support part and the coil parts. The magnetic body includes a dipping coating part formed around the coil part, a core part formed inside the coil part, an outer peripheral part formed outside the coil part, and first and second cover parts formed above and below the coil part. The dipping coating part contains metal powder having shape anisotropy.Type: GrantFiled: April 7, 2016Date of Patent: January 28, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Soo Park, Ji Hyun Eom, Jae Yeol Choi
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Patent number: 10504644Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: GrantFiled: August 14, 2017Date of Patent: December 10, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Sam Lee, Eo Jin Choi, Jae Hun Kim, Ji Hyun Eom, Hye Yeon Cha
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Patent number: 10490337Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: GrantFiled: March 4, 2019Date of Patent: November 26, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Patent number: 10340073Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: GrantFiled: July 20, 2016Date of Patent: July 2, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Publication number: 20190198233Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: ApplicationFiled: March 4, 2019Publication date: June 27, 2019Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Publication number: 20180122546Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: ApplicationFiled: August 14, 2017Publication date: May 3, 2018Inventors: Yong Sam LEE, Eo Jin CHOI, Jae Hun KIM, Ji Hyun EOM, Hye Yeon CHA
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Publication number: 20170032885Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: ApplicationFiled: July 20, 2016Publication date: February 2, 2017Inventors: Woo Jin LEE, Youn Soo KIM, Dong Hwan LEE, Ho Jin YUN, Ji Hyun EOM, Chan YOON
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Publication number: 20170004915Abstract: A coil electronic component includes coil parts formed on both surfaces of a support part and a magnetic body enclosing the support part and the coil parts. The magnetic body includes a dipping coating part formed around the coil part, a core part formed inside the coil part, an outer peripheral part formed outside the coil part, and first and second cover parts formed above and below the coil part. The dipping coating part contains metal powder having shape anisotropy.Type: ApplicationFiled: April 7, 2016Publication date: January 5, 2017Inventors: Moon Soo PARK, Ji Hyun EOM, Jae Yeol CHOI
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Publication number: 20140331493Abstract: A method of fabricating a package substrate includes: preparing a base substrate; forming a metal material layer surrounding an entire surface of the base substrate; forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed; forming pads contacting lateral surfaces of the sacrificial patterns; forming a gold plating layer on upper surfaces of the pads; and removing the sacrificial patterns and removing portions of the metal material layer to form a conductive layer that remains on partial regions so as to contact lower surfaces of the pads.Type: ApplicationFiled: July 23, 2014Publication date: November 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyo Bin PARK, Jeong Suk LEE, Ji Hyun EOM, Nam Gil LEE