Patents by Inventor Ji-Hyung Jung
Ji-Hyung Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210111478Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: ApplicationFiled: February 12, 2020Publication date: April 15, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Jae Yeong KIM, Sung Yong AN, Sung Nam CHO, Ji Hyung JUNG
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Publication number: 20210066814Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: ApplicationFiled: January 2, 2020Publication date: March 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
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Publication number: 20210050651Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.Type: ApplicationFiled: January 9, 2020Publication date: February 18, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyung JUNG, Sung Yong AN
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Publication number: 20210036407Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: ApplicationFiled: March 24, 2020Publication date: February 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Sung Yong AN, Ji Hyung JUNG, Jae Yeong KIM, Ju Hyoung PARK, Sung Nam CHO
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Publication number: 20210005365Abstract: A coil component includes a nonmagnetic body having a cured product of a polymer resin, an insulating substrate embedded in the body and having a thickness of 30 ?m or less, a coil portion including first and second coil patterns respectively disposed on first and second opposing surfaces of the insulating substrate, and first and second external electrodes disposed on a surface of the body to be connected to each of the first and second coil patterns exposed to the surface of the body.Type: ApplicationFiled: November 4, 2019Publication date: January 7, 2021Inventors: Ji Hyung Jung, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 10847308Abstract: A coil component includes: an internal coil including a coil body and first and second lead portions; and first and second external electrodes electrically connected to the internal coil. At least one of the first and second lead portions may include first and second lead wires and at least one extension wire connected to at least one of the first and second lead wires and directly connected to the external electrode.Type: GrantFiled: January 2, 2018Date of Patent: November 24, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyung Jung, Byeong Cheol Moon
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Publication number: 20200335256Abstract: A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.Type: ApplicationFiled: August 2, 2019Publication date: October 22, 2020Inventors: Ji Hyung JUNG, Byeong Cheol MOON, Jae Hun KIM, Joung Gul RYU
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Publication number: 20200335870Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: February 27, 2020Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Publication number: 20200313279Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: January 2, 2020Publication date: October 1, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Publication number: 20190287711Abstract: A coil component includes a body including a coil, and an external electrode disposed on an external surface of the body and connected to the coil, wherein the body includes a support member supporting the coil and including a through-hole and a via hole spaced apart from the through-hole, the coil includes a coil body and a lead portion connecting the coil body and the external electrode to each other, and a support thin film layer is interposed between one surface of the support member and one surface of the lead portion facing the one surface.Type: ApplicationFiled: October 29, 2018Publication date: September 19, 2019Inventors: Jae Hun KIM, Ji Hyung JUNG, Mi Geum KIM, Ji Man RYU, Do Young JUNG, Joung Gul RYU
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Publication number: 20190198234Abstract: An inductor includes a body including a coil having a support member having a through hole and disposed on at least one surface of the support member, and a magnetic material encapsulating the support member and the coil, and filling the through hole, and external electrodes disposed on external surfaces of the body. The coil includes a plurality of coil patterns and an insulating layer disposed on surfaces of the plurality of coil patterns to insulate the plurality of adjacent coil patterns from each other, and the insulating layer includes a ceramic material.Type: ApplicationFiled: August 13, 2018Publication date: June 27, 2019Inventors: Ji Hyung JUNG, Boum Seock KIM, Kang Wook BONG
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Publication number: 20190088407Abstract: A coil component includes : a body portion; a coil portion; and an electrode portion, wherein the coil portion includes: a support member; a first coil layer disposed on a first surface of the support member, having first conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a second coil layer disposed on a second surface of the support member, having second conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a via hole penetrating through the support member and partially overlapping innermost end portions of the first and second conductive patterns; and a via conductor filling a portion of the via hole and connected to the innermost end portions of the first and second conductive patterns.Type: ApplicationFiled: May 3, 2018Publication date: March 21, 2019Inventors: Ji Hyung JUNG, Boum Seock KIM, Byeong Cheol MOON
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Patent number: 10236112Abstract: A coil component includes a body including a plurality of dielectric layers that are stacked and a plurality of conductor patterns formed on respective dielectric layers and connected to each other by conductive vias, and external electrodes connected to end portions of the plurality of conductor patterns. At least portions of the external electrodes are recessed in the body.Type: GrantFiled: November 10, 2016Date of Patent: March 19, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Ji Hyung Jung
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Publication number: 20180358171Abstract: A coil component includes a coil and external electrodes electrically connected to the coil. The coil may include a plurality of coil patterns. A distal end of an outermost coil pattern may include a gap filling portion. A through via directly connected to an innermost coil pattern may also include a gap filling portion.Type: ApplicationFiled: May 17, 2018Publication date: December 13, 2018Inventors: Ji Hyung JUNG, Boum Seock KIM, Kang Wook BONG
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Publication number: 20180350509Abstract: A coil component includes: an internal coil including a coil body and first and second lead portions; and first and second external electrodes electrically connected to the internal coil. At least one of the first and second lead portions may include first and second lead wires and at least one extension wire connected to at least one of the first and second lead wires and directly connected to the external electrode.Type: ApplicationFiled: January 2, 2018Publication date: December 6, 2018Inventors: Ji Hyung JUNG, Byeong Cheol Moon
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Patent number: 10147533Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: GrantFiled: April 7, 2016Date of Patent: December 4, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hyun Lyoo, Se Woong Paeng, Jung Min Kim, Jeong Gu Yeo, Tae Hoon Kim, Sang Jun Lee, Ji Hyung Jung, Ji Man Ryu, Do Young Jung
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Publication number: 20170207018Abstract: A coil component includes a body including a plurality of dielectric layers that are stacked and a plurality of conductor patterns formed on respective dielectric layers and connected to each other by conductive vias, and external electrodes connected to end portions of the plurality of conductor patterns. At least portions of the external electrodes are recessed in the body.Type: ApplicationFiled: November 10, 2016Publication date: July 20, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Ji Hyung JUNG
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Publication number: 20160351321Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: ApplicationFiled: April 7, 2016Publication date: December 1, 2016Inventors: Soo Hyun LYOO, Se Woong PAENG, Jung Min KIM, Jeong Gu YEO, Tae Hoon KIM, Sang Jun LEE, Ji Hyung JUNG, Ji Man RYU, Do Young JUNG
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Publication number: 20070081265Abstract: A color wheel unit and a fabrication method thereof are disclosed. The color wheel unit comprises a color wheel positioned on a light path and having RGB segments, which are rotated to be inserted in order into the light path, and a driving apparatus for providing rotational force to the color wheel, where the color wheel is secured to the driving apparatus by laser welding. This allows a simplified process for joining the color wheel to the driving apparatus.Type: ApplicationFiled: September 28, 2006Publication date: April 12, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji-Hyung Jung, Nak-Yun Sung, Ju-Dong Oh, Kye-Woong Cho, Yong-Wan Cho